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LG U8110 Service Manual
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LG U8110 Service Manual

LG U8110 Service Manual

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Service Manual
U8110
P/N : MMBD0032201
Date: May, 2004 / Issue 1.0

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Summary of Contents for LG U8110

  • Page 1 Service Manual U8110 P/N : MMBD0032201 Date: May, 2004 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION ......6 3.2.3 Camera & Camera FPC Interface... 40 3.2.4 Camera Position Detection ..... 42 1.1 Purpose........... 6 3.2.5 Camera Regulator ......42 1.2 Regulatory Information......6 3.2.6 Display & LCD FPC Interface ..43 1.3 Abbreviations ..........
  • Page 3 Table Of Contents 3.8.2 Transmitter........85 4.20.1 Checking ........152 3.8.3 Frequency Generation ....89 4.20.2 Checking Ant. SW module ..152 4.20.3 Checking Control Signal ..... 152 4. TROUBLE SHOOTING ....91 4.20.4 Checking RF TX Level ....155 4.20.5 Checking PAM Block ....
  • Page 4 Table Of Contents 8.3.4 DCS 1800 Calibration Items ..214 8.3.5 WCDMA Calibration Items .... 217 8.3.6 Baseband Calibration Item ... 225 8.4 Program Operation ......226 8.4.1 XCALMON Program Overview ..226 8.4.2 XCALMON Icon Description ..227 8.4.3 Calibration Procedure ....230 8.4.4 Calibration Result Message ..

  • Page 5: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 6 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 7: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Cigar Lighter Adapter Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing DeskTop Charger EEPROM...
  • Page 8 1. INTRODUCTION PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory UMTS Universal Mobile Telephony System - 9 -...

  • Page 9: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Specification Shape GSM900/1 800 & WCDMA Folder- Dual Mode Handset Size 49.5 x 95.7 x 22.5 mm Weight 120g (with Battery) Power 4.0V > 1200mAh Li-Ion Over 140 Min (WCDMA, Tx=12 dBm, Voice) Talk Time Over 180 Min (GSM, Tx=Max, Voice) Over 120 hrs (WCDMA, DRX=1.28)

  • Page 10: Usable Environment

    2. PERFORMANCE 2.2 Usable environment 1) Environment Item Spec. Unit Voltage 4.0 (Typ), 3.4 (Min), (Shut Down: 3.2) Size -20 ~ + 60 °C Storage -30 ~ + 85 °C Humidity max. 85 2) Environment(Accessory) Item Spec. Typ. Unit Power Available power * CLA: 12~24V(DC) 2.3 Radio Performance...
  • Page 11 2. PERFORMANCE Item 30M ~ 1GHz -36dBm 30M ~ 1GHz -36dBm MS allocated 1G ~ 1710MHz -30dBm Channel 1710M ~ 1785MHz -36dBm 1G ~ 4GHz -30dBm Radiated 1785M ~ 4GHz -30dBm Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm Emission 880M ~ 915MHz -59dBm...
  • Page 12 2. PERFORMANCE Item Frequency offset 800kHz Intermodulation product should Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level (dBm) (dB) Level (dBm) (dB) ±3 ±3 ±3 ±3 ±3 ±3 ±3...
  • Page 13 2. PERFORMANCE 2) Transmitter-WCDMA Mode Item Specification Class3: +24dBm(+1/-3dB) Maximum Output Power Class4: +21dBm(±2dB) Frequency Error ±0.1ppm Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) +0.5/1.5 +1/3 +1.5/4.5 Inner Loop Power control in uplink -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5...
  • Page 14 2. PERFORMANCE Item Specification 33dB@5MHz, ACP>-50dBm Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1k BW -36dBm@f=150KHz~30MHz, 10k -36dBm@f=30~1000MHz, 100k Spurious Emissions -30dBm@f=1~12.75GHz, 1M *: additional requirement -41dBm*@1893.5~1919.6MHz, 300k -67dBm*@925~935MHz, 100k -79dBm*@935~960MHz, 100k -71dBm*@1805~1880MHz, 100k -31dBc@5MHz, Interferer -40dBc Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5% (>-20dBm) Error Vector Magnitude(EVM) (@12.2k, 1DPDCH+1DPCCH)
  • Page 15 2. PERFORMANCE 4) Receiver - WCDMA Mode Item Specification Reference Sensivitivity Level -106.7dBm(3.84M) -25dBm(3.84MHz) Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(class3) 33dB Adjacent Channel Selectivity(ACS) UE@+20dBm output power(class3) -56dBm/3.84MHz@10MHz In-band Blocking UE@+20dBm output power(class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(class3) -44dBm/3.84MHz@f=2050~2095 & 2185~2230MHz, band a) UE@+20dBm output power(class3) -30dBm/3.84MHz@f=2025~2050 &...

  • Page 16: Current Consumption

    2. PERFORMANCE 2.4 Current Consumption (VT test : Speaker off, LCD backlight On) Stand by Voice Call WCDMA 120Hours=10mA 140Min=514mA 100Min=720mA (DRX=1.28) (Tx=12dBm) (Tx=12dBm) 150Hours=8mA 180Min=400mA (paging=9period) (Tx=Max) 2.5 RSSI WCDMA(TBD) BAR 4 → 3 -91 ±2dBm BAR 3 → 2 -96 ±2dBm BAR 2 →...

  • Page 17: Sound Pressure Level

    2. PERFORMANCE 2.7 Sound Pressure Level Test Item Specification Sending Loudness Rating (SLR) 8±3dB -1±3dB Receiving Loudness Rating (RLR) -13±1dB Side Tone Masking Rating (STMR) 17dB over Echo Loss (EL) 40dB over Sending Distortion (SD) refer to TABLE 30.3 Receiving Distortion (RD) refer to TABLE 30.4 Idle Noise-Sending (INS) -64dBm0p under...

  • Page 18: Charging

    2. PERFORMANCE 2.8 Charging • Normal mode: Complete Voltage: 4.2V Charging Current: 600mA • Await mode: In case of During a Call, should be kept 3.9V (GSM: It should be kept 3.9V in all power level WCDMA: It will not be kept 3.9V in some power level) Extend await mode: At Charging prohibited temperature(-20C under or 60C over) (GSM: It should be kept 3.7V in all power level WCDMA: It will not be kept 3.7V in some power level)

  • Page 19: Technical Brief

    3. TECHNICAL BRIEF 3. Technical Brief 3.1 Digital Baseband(DBB) & Multimedia Processor 3.1.1 General Description A. Features • CPU ARM946 running at 104 MHz - 32 kB Instruction Cache, 16 kB Data Cache, 128 kB Instruction TCM and 128 kB Data TCM - 8 channel DMAC •...

  • Page 20: Hardware Architecture

    3. TECHNICAL BRIEF 3.1.2 Hardware Architecture The hardware structure is delivered as five separate hardware macros to the top-level design, also depicted in Figure. Figure. Simplified Block Diagram - 21 -...
  • Page 21 3. TECHNICAL BRIEF A. Block Diagram Figure. Simplified Block Diagram B. CPU Hardware Subsystem The CPU subsystem incorporates: • CPU Sub chip • Backplane • JTAG • DMA Controller • System Buffer RAM • Boot ROM • External Memory Interface (EMIF) for connection to external SRAM and Flash memories. The bus architecture is built on the ARM AMBA standard with multi-layer AHB (Advanced High-speed Bus) and APB (Advanced Peripheral Bus) for the peripheral buses.
  • Page 22 3. TECHNICAL BRIEF C. Peripheral Hardware Subsystem There are 29 peripherals within the peripheral hardware subsystem. With the exception of the USB, all hardware peripheral blocks are APB slave peripherals. From an architecture-hierarchy perspective, the SYSCON block is an APB slave on the slow APB bridge, but resides at the top level of the ASIC. The APB provides a simple interface to support low-performance peripherals.
  • Page 23 3. TECHNICAL BRIEF G. System Control Subsystem The system controller subsystem (SYSCON) is primarily responsible for generating clock signals and distributing the clock and reset signals within the ASIC and certain external devices. The GSM core, GAM and DSP subsystems include their own system controllers that are sourced from SYSCON. SYSCON consists of analog and digital PLL clocks and a clock squarer.

  • Page 24: External Memory Interface

    54MHz PSRAM S71WS256HC0BAW00 70 ns 20 ns – 70 ns Table External memory interface for U8100 & U8110 B. U8120 • 512Mb flash memory + 64Mb PSRAM • 3-CS(Chip Select) are used Interface Spec. Read Access Time Write Device...

  • Page 25: Rf Interface

    3. TECHNICAL BRIEF 3.1.4 RF Interface A. MARITA Interface Marita controls GSM RF part using these signals through GSM RF chip-Ingela. • RFCLK, RFDAT, RFSTR : Control signals for Ingela • TXON, RXON : Control signals for TX and RX part of Ingela •...
  • Page 26 3. TECHNICAL BRIEF Figure. Schematic of WANDA RF Interface • RADIO_CLK, RADIO_DAT, RADIO_STR : Control signals for Wivi & Wopy • RXIA, RXIB, RXQA, RXQB : WCDMA RX Data • TXIA, TXIB, TXQA, TXQB : WCDMA TX Data • HSSLRX_D, HSSLRX_CLK : Marita &...

  • Page 27: Sim Interface

    3. TECHNICAL BRIEF 3.1.5 SIM Interface SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(MARITA) with ABB(VINCENNE) and filter. SIM (Interface between DBB and ABB) SIMDAT0 SIM card bidirectional data line SIMCLK0 SIM card reference clock SIMRST0 SIM card async/sync reset Table.

  • Page 28: Gpio (General Purpose Input/Output) Map

    3. TECHNICAL BRIEF 3.1.7 GPIO (General Purpose Input/Output) map In total 40 allowable resources. This model is using 25 resources. GPIO Map, describing application, I/O state, and enable level are shown in below table. IO # Application Resource Inactive State Active State GPIO00 Not used...
  • Page 29 3. TECHNICAL BRIEF IO # Application Resource Inactive State Active State GPIO32 KEY_LED_ONOFF GPIO High GPIO33 Not used – – – – GPIO34 Not used – – – – GPIO35 LCDVSYNCI (Not used) GPIO High GPIO36 SPKMUTE GPIO LOW (Ear piece) HIGH (Speaker) GPIO37 Not used –...

  • Page 30: Usb

    3. TECHNICAL BRIEF 3.1.8 USB The USB block supports the implementation of a "full-speed" device fully compliant to USB 2.0 standard. It provides an interface between the CPU (embedded local host) and the USB wire, and handles USB transactions with minimal CPU intervention. The USB specification allows up to 15 pairs of endpoints.
  • Page 31 3. TECHNICAL BRIEF USB regulator input voltage is 5V and uses external USB device power through IO Connector. Output voltage is 3.3V and supply to MARITA USB block. USB is detected by MARITA GPIO40(USBSENES). • VUSB / (10K + 51K) = VUSBSENSE / 51K Figure.

  • Page 32: Irda Interface

    3. TECHNICAL BRIEF 3.1.9 IrDA Interface MARITA supports FIR, MIR and SIR mode. In this model, the IrDA block supports SIR (Standard IrDA) mode. SIR supports data rates up to 115,200 bps, including 9,600/19,200/38,400/57,600 bps. In this mode, IrDA uses eight data bits per character and one stop bit. IrDA supports a protocol defined by the IrDA Association.

  • Page 33: Folder On/Off Operation

    3. TECHNICAL BRIEF 3.1.10 Folder ON/OFF Operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch (U1 on keypad), the voltage at pin2 of U1 goes to 0V. Otherwise, 2.8V.

  • Page 34: Power On Sequence

    3. TECHNICAL BRIEF 3.1.11 Power On Sequence 1 User press END key and ONSWAn signal is changed to Low. 2 VINCENNE initiate the internal oscillator and power up the regulators. 3 VINCENNE generate a power for MARITA. 4 VINCENNE release the power reset signal(PWRRSTn) and generate an interrupt(IRQ0n) to MARITA.

  • Page 35: Key Pad

    3. TECHNICAL BRIEF 3.1.12 Key Pad There are 26 buttons and 3 side keys in Figure 3-xx.Shows the Keypad circuit.‘END’ Key is connected ONSWAn from Vincenne. KEYIN0 KEYIN1 KEYIN2 KEYIN3 KEYIN4 KEYOUT0 SIDE1 SIDE2 SIDE3 KEYOUT1 KEYOUT2 DOWN KEYOUT3 RIGHT KEYOUT4 SEND CLEARER...

  • Page 36: Gam Hardware Subsystem

    3. TECHNICAL BRIEF 3.2 GAM Hardware Subsystem Figure. GAM Subsystem Functional Block Diagram 3.2.1 General Description The Graphics Accelerator Module (GAM) subsystem provides hardware support in the creation of visual imagery and the transfer of this data to the display. GAM also provides support for the camera module.

  • Page 37: Block Description

    3. TECHNICAL BRIEF 3.2.2 Block Description GAM Controller(GAMCON) The GAM Controller (GAMCON) is responsible for clock gating and distribution within the GAM module. GAMCON receives the HCLK from SYSCON and distributes to GRAPHCON, GRAM, PDI and CDI. GAMCON also distributes the GAM reset signal to GRAPHCON, GRAM, PDI and CDI. The reset signals CIRES_N and PDIRES_N are distributed from GAMCON to the camera and display module respectively, see Figure.
  • Page 38 3. TECHNICAL BRIEF Camera Data Interface (CDI) Block The camera data interface (CDI) block is designed to support a range of still image camera modules. An 8-bit parallel bus supports data transfer from the camera module to the CDI. The pixel clock is an output clock from the camera module to the CDI and qualifies the data on the parallel bus.

  • Page 39: Camera & Camera Fpc Interface

    3. TECHNICAL BRIEF 3.2.3 Camera & Camera FPC Interface PDID1 PDID1 VDIG PDID2 PDID2 PDID3 PDID3 PDID4 PDID4 PDID5 PDID5 PDID6 PDID6 PDID7 PDID7 I2CSCL I2CSDA I2CDAT CIPCLK CIPCLK CIVSYNC CIVSYNC CIHSYNC CIHSYNC CIRES_N CIRES_N CID0 CID0 CID1 CID1 CID2 CID2 CID3 CID3...
  • Page 40 3. TECHNICAL BRIEF The Camera module is connected to main board with 20pin Board to Board connector (AXK7L80225). Its interface is dedicated camera interface port in Marita. The camera port supply 24MHz master clock to camera module and receive 12MHz pixel clock (30fps), vertical sync signal, horizontal sync signal, reset signal and 8bits YUV data from camera module.

  • Page 41: Camera Position Detection

    3. TECHNICAL BRIEF 3.2.4 Camera Position Detection GPIO_04 detects the Camera Position (front or back) Figure. Camera Position Detection 3.2.5 Camera Regulator GPIO_20 enables Camera Regulator Operation Figure. Camera Regulator - 42 -...

  • Page 42: Display & Lcd Fpc Interface

    3. TECHNICAL BRIEF 3.2.6 Display & LCD FPC Interface LCD module include device in table 3-2 Device Type Main LCD 176 x RGB x 220 65K Color TFT LCD Sub LCD 96 x 64 Mono FSTN LCD Main LCD Backlight White LED Sub LCD Backlight 7 color LED...
  • Page 43 3. TECHNICAL BRIEF SYMBOL FUNCTION REMARKS Ground CAM_FLASH_SHOT Turn ON the Camera Flash Shot MOTOR_BATT MOTOR Power SPKP Loud Speaker Plus SPKM Loud Speaker Minus Enable Signal for Sub LCD Backlight EN_LED_G LED(Green) 7C_LED_VDD Power Supply for Sub LCD Backlight BL_EN Enable Signal for Main LCD Backlight PDID0...
  • Page 44 3. TECHNICAL BRIEF SYMBOL FUNCTION REMARKS PDID3 Parallel Data 3 bit for Main/Sub LCD PDID1 Parallel Data 1 bit for Main/Sub LCD BL_PWL Main LCD PWL signal VBATI_4.2V Battery Power(4.2V) Enable Signal for Sub LCD Backlight EN_LED_B LED(Blue) Enable Signal for Sub LCD Backlight EN_LED_R LED(Red) EARP...

  • Page 45: Main Lcd Backlight Illumination

    3. TECHNICAL BRIEF 3.2.7 Main LCD Backlight Illumination There are 4 white LEDs in Main LCD Backlight circuit which are driven by 4.5V Regulated Output Charge Pump(SC604). GPIO_01(BL_PWL) is used for Backlightbrightness control. Figure. Charge Pump Circuit for Main LCD Backlight * LED : SSC-HWTS902(Seoul Semiconductor) - 46 -...

  • Page 46: Sub Lcd Backlight Illumination

    3. TECHNICAL BRIEF 3.2.8 Sub LCD Backlight Illumination GPIO_02(7C_LED_VDD_EN) in Marita enables 7 color LED. 7 color LED consists of Red LED, Green LED and Blue LED. GPIO_44(EN_LED_R), GPIO_45(EN_LED_G) and GPIO_46(EN_LED_B) in Marita does ON or OFF its own LEDs. Figure.

  • Page 47: Keypad Illumination

    3. TECHNICAL BRIEF 3.2.9 Keypad Illumination There are 19 blue LEDs in key board backlight circuit, which aredriven by GPIO_32 (KEY_LED_ONOFF) line form Marita. Figure. Keypad Backlight Blue LED Interface Figure. Keypad Backlight Circuit - 48 -...

  • Page 48: Camera Flash Illumination

    3. TECHNICAL BRIEF 3.2.10 Camera Flash Illumination Camera Flash illumination circuit make 3 modes using white LED. Mode 1. Is Continuous ON mode using GPIO_21(CAM_FLASH_ON), Mode 2. Is Flash Shot using GPIO_23(CAM_FLASH_SHOT) and Mode 3. combines Mode 1. and Mode 2. Figure.

  • Page 49: Lcd Module

    3. TECHNICAL BRIEF 3.3 LCD Module Figure. LCD Module Block Diagram Figure. LCD Module(Main & Sub LCD) - 50 -...

  • Page 50: Analog Baseband (Abb) Processor

    3. TECHNICAL BRIEF 3.4 Analog Baseband (ABB) Processor 3.4.1 Overview of Audio path Figure. Audio Path Block Diagram - 51 -...

  • Page 51: Audio Signal Processing & Interface

    3. TECHNICAL BRIEF 3.4.2 Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip (Marita). This transmitted signal is reformed to fit in GSM &...
  • Page 52 3. TECHNICAL BRIEF Figure. Audio Section scheme - 53 -...

  • Page 53: Audio Mode

    3. TECHNICAL BRIEF 3.4.3 Audio Mode Audio Mode includes three states. (Voice call, Midi.MP3). Each states is sorted by the total 7 Modes according to external Devices (Receiver, Loud Speaker, Headset). Video Telephony Mode Operate on state of the WCDMA CALL. VINCENNE In/Out Port Mode Receiver Mode...

  • Page 54: Voice Call

    3. TECHNICAL BRIEF 3.4.4 Voice Call 3.4.4.1 Voice call Downlink Mode(Receiver, Speaker, Headset) This section provides a detailed description of the Voice Call RX functions. Figure. Voice call Downlink Scheme - 55 -...
  • Page 55 3. TECHNICAL BRIEF The voice decoder accepts a serial input stream of linear PCM coded speech. The receive band-pass filter is the next step in the CODEC receive path. Following the filter is the DAC, followed by a PGA enabling to adjust or trim the circuit in the product for different sensitivity of the earphone and spread in the RX path.
  • Page 56 3. TECHNICAL BRIEF 3.4.4.2 Voice Call Uplink Mode (Receiver, Speaker, Headset) This section provides a detailed description of the Voice Call TX functions. Figure. Voice call Uplink Scheme The Uplink supports two microphones and two auxiliary inputs to the speech encoder blocks. Both microphone inputs are compatible with an electric microphone.
  • Page 57 3. TECHNICAL BRIEF Each Voice Uplink Mode paths shown below. Receiver Mode : C-MIC(OBG-15S44) → TJATTE2 IN (MICP/N) → TJATTE2 OUT (MICP_INT/MICN_INT) → VICENNE Input(MIC1N/1P) Loud Speaker Mode : C-MIC(OBG-15S44) → TJATTE2 IN (MICP/N) → TJATTE2 OUT(MICP_INT/MICN_INT) → VICENNE Input(MIC1N/1P) Video Telephony Mode : C-MIC(OBG-15S44) →...

  • Page 58: Midi (Ring Tone Play)

    3. TECHNICAL BRIEF 3.4.5 MIDI (Ring Tone Play) This section provides a detailed description of the MIDI and WAV-file functions. Figure. MIDI Scheme External MIDI path is the same as Voice Loudspeaker downlink Mode, except source in MARITA (DSP and Audio Mixer). •...

  • Page 59: Mp3 (Audio Player)

    3. TECHNICAL BRIEF 3.4.6 MP3 (Audio Player) This section provides a detailed description of the MP3 file functions. Figure. MP3 Scheme MP3 function supports PCM 44/48KHz sampling rate.The PCM44/48 RX-path is intended to be used as a stereo music headphones. It is also possible to connect a differential load or to use the RX-path with only one channel running (mono).

  • Page 60: Video Telephony

    3. TECHNICAL BRIEF 3.4.7 Video Telephony This section provides a description of the Video Telephony functions. Figure. Video Telephony Scheme Video Telephony Mode has same paths with Loud Speaker Mode. STATE(SPK ONLY) SPKMUTE AMPCTRL Video Telephony ON High Video Telephony OFF High Tabel Video Telephony GPIO Control STATE * SPKMUTE;...

  • Page 61: Audio Main Component

    3. TECHNICAL BRIEF 3.4.8 Audio Main Component There are 6 components in U8100 schematic Diagram. Part Number marked on U8100 Schematic Diagram. ITEM Part Name Part Number Dual Speaker EMD1940A C-MIC OBG-15S44 X2603 Audio AMP LM4894IBP N2601 TJATTE2 IP4025CS20 N2602 Ear-JACK HSJ1730 X2602...
  • Page 62 3. TECHNICAL BRIEF Figure. TJATTE2 Block Diagram - 63 -...

  • Page 63: Gpadc(General Purpose Adc) And Autoadc2

    3. TECHNICAL BRIEF 3.4.9 GPADC(General Purpose ADC) and AUTOADC2 The GPADC consists of a 14 input MUX and an 8-bit ADC. The analog input signal is selected with the MUX and converted in the ADC. The GPADC has a built in controller, AUTOADC2, which is able to operate in the background without software intervention.

  • Page 64: Charger Control

    3. TECHNICAL BRIEF 3.4.10 Charger control A programmable charger in AB2000 is used for battery charging. It is possible to set limits for the output voltage at CHSENSE- and the output current from DCIO via the sense resistor to CHSENSE-. The voltage at CHSENSE- and the current feed to CHSENSE- cannot be measured directly by the GPADC.

  • Page 65: Fuel Gauge

    3. TECHNICAL BRIEF 3.4.11 Fuel Gauge AB2000 supports the measurement of the current consumption/charging current in the U8100 with a fuel gauge block. By constantly integrating the current flowing into and out of the battery, the fuel gauge block is used to determine the remaining battery capacity. The function of the fuel gauge block is schematically described in Figure.

  • Page 66: Battery Temperature Measurement

    3. TECHNICAL BRIEF 3.4.12 Battery Temperature Measurement The BDATA node, the constant current source, feed the battery data output while monitoring the voltage at the battery data node with GPADC. This battery data is converted to the battery temperature. Figure shows the schematic of battery temperature measurement part. Figure.

  • Page 67: Charging Part

    3. TECHNICAL BRIEF 3.4.13 Charging Part The charging block in AB2000 processes the charging operation by using VBAT voltage. It is enabled or disabled by the assertion/negation of the external signal DCIO. Part of the charging block are activated and deactivated depending on the level of VBAT. Figure shows the schematic of charging part.
  • Page 68 3. TECHNICAL BRIEF Trickle charging When the VBAT is below a certain value, 3.2V, a current generator take care of internal trickle charge signal is active. The charging current is set to 50mA. Parameter Unit Trickle current Table BDATA channel spec Normal charging When the VBAT voltage is within limits or the internal regulators are turned on, the current source for trickle charging is turned off and all parts of the charging block are active.
  • Page 69 3. TECHNICAL BRIEF • Charging Method : CCCV (Constant Current Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 600mA • Nominal Battery Capacity : 1200 mAh • Charger Voltage : 4.6V • Charging time : Max 3.5h •...

  • Page 70: Voltage Regulation

    3. TECHNICAL BRIEF 3.5 Voltage Regulation 3.5.1 Internal Regulation There are LDO (Low Drop Output) regulators and BUCK converter in AB2000 (Vincenne) chip. LDO regulators and BUCK converter generate the following voltages : 1.5V, 1.8V and 2.75V. The output of these LDOs supply VDD-A, VDD-B and VDIG with 2.75V.
  • Page 71 3. TECHNICAL BRIEF Figure. Power Supply Scheme Name Type Output voltage Description VDD_A Power Supply 2.75V Supply output VDD_B Power Supply 2.75V Supply output VDD_D Power Supply 2.75V Supply output VDD_E Power Supply 1.8V Supply output VDDLP Power Supply 1.5V Low Power supply output VDDBUCK Power Supply...

  • Page 72: General Description

    3. TECHNICAL BRIEF 3.6 General Description The RF part includes a dual-band GSM/DCS part (900 and 1800MHz) and W-CDMA part for IMT-2000 (UL 1900MHz, DL 2100MHz). It also contains Antenna Switch, WCDMA duplexer, WCDMA Power Amplifier and GSM Power Amplifier. The whole structure of Radio part is shown in Figure 3-1.
  • Page 73 3. TECHNICAL BRIEF The control flow for the Radio is shown in Figure 3-2. Figure 3-2. RF control signal flow diagram The Marita(the main processor) controls the overall radio system. In the GSM/GPRS air interface mode, this control is handled via direct interfaces to individual RF components. The Marita(the main processor) also handles the antenna switch mechanism for selection of mode.

  • Page 74: Gsm Mode

    3. TECHNICAL BRIEF 3.7 GSM Mode 3.7.1 Receiver The received RF signal on the antenna connector arrives via antenna switch at external band pass filters for band selectivity. One filter is required per supported GSM band. The corresponding LNA amplifies the signal for optimum noise suppression. The LNA output signal is mixed with the on-channel LO generated by the proper VCO and transformed into a Q and an I signal.
  • Page 75 3. TECHNICAL BRIEF B. Receiver Block. The circuit contains one frequency down-conversion section for each receive band and a common base band amplifier and filter section. The GSM900 RF part consists of a low noise amplifier followed by high dynamic range mixers. The DCS 1800 RF part also has low noise amplifier connected to the other mixers.
  • Page 76 3. TECHNICAL BRIEF C. LO Block The LO signals from the receive VCO section drive the dividers for GSM 900 and DCS 1800 respectively to provide quadrature LO signals to the receive mixers. The LO signal is also supplied to the prescaler and transmit output buffer.
  • Page 77 3. TECHNICAL BRIEF D. VCO Block The VCOs are fully integrated balanced LC oscillators with on-chip resonators. The receive VCOs run on double frequency. Different frequency ranges can be selected in the VCOs for GSM/DCS band operation. The VCOs are supplied from a separated external voltage regulator to avoid frequency pushing and up conversion of low frequency noise.
  • Page 78 3. TECHNICAL BRIEF E. PLL Block The PLL consists of a programmable prescaler with multiple division ratios and a phase and frequency detector with a charge pump with programmable output current. Channel frequency selection and transmitter modulation is controlled via the prescaler modulus inputs MODA ~ MODD and the prescaler offset value N offset.

  • Page 79: Transmitter

    3. TECHNICAL BRIEF 3.7.2 Transmitter A 4-bit sigma-delta bit stream comes from the Marita ASIC including both channel information and the GMSK phase information. Via the 3-wire control bus also driven from Marita, the selection of transmitter band is made. The 4bits from the bit stream provides the fine-tuning of the division ratio before going to the divider of the used VCO (low band, 900MHz or high band, 1800MHz).
  • Page 80 3. TECHNICAL BRIEF B. Power Amplifier The Power Amplifier (N1300) is intended for use in EGSM and DCS/PCS mobile equipment. It is a module with two parallel amplifier chains, with one chain for the EGSM transmitter section and one for the DCS/PCS transmitter section.

  • Page 81: Wcdma Mode

    3. TECHNICAL BRIEF 3.8 WCDMA Mode 3.8.1 Receiver The received RF signal on the antenna connector arrives via the antenna switch to the duplexer. The duplexer directs the signal to the LNA, which resides in Wopy (W-CDMA Receive ASIC) as every other active part of the radio receiver.
  • Page 82 3. TECHNICAL BRIEF B. RFLO Section The VCO is a fully integrated balanced LC oscillator with on-chip resonator. An on-chip varactor is used to control the frequency over the desired tuning range. A separate external voltage regulator supplies the VCO with power to avoid frequency pushing and up conversion of low frequency noise.
  • Page 83 3. TECHNICAL BRIEF C. Reference Section The reference block consists of a balanced oscillator and a buffer amplifier. The crystal unit and the feedback capacitors are external. The current consumption when only the reference oscillator and the output buffer are activated must be kept to an absolute minimum. Figure 3-11.

  • Page 84: Transmitter

    3. TECHNICAL BRIEF 3.8.2 Transmitter Analogue differential signals (currents), representing I and Q, are sent to the radio ASCI Wivi (W- CDMA Transmitter ASIC) from the D/A converter in Wanda (W-CDMA digital base-band coprocessor ASIC). The signals are filtered in a reconstruction filter and then modulated up to 380MHz (using the IFLO signal).
  • Page 85 3. TECHNICAL BRIEF D. IF Band Bass Filter (IFBP) The IF filter suppresses spurious signals and eliminates unwanted frequency components generated in the IQ modulator and subsequently amplified in the VGA. The filter is tuned using an external RLC load as shown in Figure 3-12. Figure 3-12.
  • Page 86 (RF). The mixer can be switched between three different gain levels: high gain (HG), medium gain (MG), and low gain (LG). The LO buffer provides the buffering for either an internal LO signal generated within the internal RFPLL, or an external LO signal applied to the RFLO/RFLOBAR pins.
  • Page 87 3. TECHNICAL BRIEF F. Power Amplifier The N1630(RF9266) is a high-power, high-efficiency linear amplifier module targeting W-CDMA transmitter ASIC. The module is fully matched to 50( for easy system integration and utilizes advanced GaAs HBT process technology. The PA features an integrated RF power output detection network and is compatible with DC-DC converter operation in DC power management applications.

  • Page 88: Frequency Generation

    3. TECHNICAL BRIEF 3.8.3 Frequency Generation The Wopy (W-CDMA Receive ASIC) contains the active elements for a 13MHz VCXO, which is designed to be the reference frequency of the UE. There are two synthesizers in the W-CDMA part of the radio, an intermediate frequency (IF) synthesizer and a radio frequency (RF) synthesizer.
  • Page 89 3. TECHNICAL BRIEF A. IF PLL The IF LO frequency synthesis comprises the four following parts: - Input buffer: A 13MHz input buffer with DC-biasing provided at source. - VCO: Operating on 1.52GHz which is 4times the TX-IF frequency (380MHz) and 8 times the RX-IF (190MHz), this is a fully integrated balanced LC oscillator with on-chip resonator.

  • Page 90: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Power ON Trouble START Charge or change The vol tage of main battery main battery is higher than 3.2V ? Follow the Press END key. LCD Trouble Longer than 3 Seconds shooting guide Keypad LED ON? Follow the END key oper ates wel l?
  • Page 91 4. TROUBLE SHOOTING Pin #3 N2203 R2202 < Main Board - Top side > R1810 R1811 R2210 R2201 R2200 < Main Board - Bottom side > - 92 -...

  • Page 92: Usb Trouble

    4. TROUBLE SHOOTING 4.2 USB Trouble START (Measure during the state of USB module running) Check host USB port Input power(N2204, pin1) is 5V? or USB cable Resolder or change N2204 Output power(N2204, pin5) is 3.3V? Resolder R2232 or R2233 USBSENSE level is 2.8V? Resolder R3103 VUSB(R3103) is 3.3V?

  • Page 93: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.3 SIM Detect Trouble • SIM control path - MARITA generates SIM interface signals(2.75V level) to VINCENNE. - Vincenne converts SIM interface signals to 1.8V/3V. START Reconnect SIM card Finish SIM work well? Resolder X2300 on main PCB and check the contact between X2300 and SIM card SIM work well?

  • Page 94: Keypad Trouble

    4. TROUBLE SHOOTING 4.4 Keypad Trouble • Keypad signals go to MARITA and VINCENNE through board-to-board connector. START Press the keypad Finish Keypad operates well? Resolder X3200 on main board and CN962 on keypad Finish Keypad operates well? Change Keypad Finish Keypad operates well? Change main board...

  • Page 95: Camera Trouble

    4. TROUBLE SHOOTING 4.5 Camera Trouble Camera control signals are generated by Marita - 96 -...
  • Page 96 4. TROUBLE SHOOTING Camera control signals are generated by Marita - 97 -...

  • Page 97: Main Lcd Trouble

    4. TROUBLE SHOOTING 4.6 Main LCD Trouble LCD control signals are generated by Marita. - 98 -...

  • Page 98: Sub Lcd Trouble

    4. TROUBLE SHOOTING 4.7 Sub LCD Trouble - 99 -...

  • Page 99: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.8 Keypad Backlight Trouble - 100 -...
  • Page 100 4. TROUBLE SHOOTING - 101 -...

  • Page 101: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.9 Folder ON/OFF Trouble - 102 -...
  • Page 102 4. TROUBLE SHOOTING VCAM R3206 100K CAMERA_DET C3204 0.1u C3205 Be sure that magnet is here - 103 -...

  • Page 103: Camera Detection Trouble

    4. TROUBLE SHOOTING 4.10 Camera Detection Trouble - 104 -...
  • Page 104 4. TROUBLE SHOOTING - 105 -...

  • Page 105: Camera Flash Trouble

    4. TROUBLE SHOOTING 4.11 Camera Flash Trouble - 106 -...
  • Page 106 4. TROUBLE SHOOTING - 107 -...

  • Page 107: Audio Trouble Shooting

    4. TROUBLE SHOOTING 4.12 Audio Trouble Shooting A. Receiver • Signals to the receiver – Receiver signals are generated at Vincenne • BEARP, BEARM – Receiver path : • 1. Vincenne (BEARP, BEARM) -> • 2. X3200 on main board -> •...
  • Page 108 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the m ain board at R2619 ? Does the sine wave appear Change the Key boar d at Num ber 36, 37 pin in the key B' d CN963? Does the sine wave appear...
  • Page 109 4. TROUBLE SHOOTING R2619 Pin 36, 37 CN963 - 110 -...
  • Page 110 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal Measured 1khz Sine Wave Signal - 111 -...
  • Page 111 4. TROUBLE SHOOTING B. Speaker (Voice Loud Speaker, Midi, MP3, Key Tone) • Signals to the speaker – Speaker signals are generated at Vincenne • BEARP – Speaker path : • 1. Vincenne (BEARP) -> • 2. C2604 on main board -> •...
  • Page 112 4. TROUBLE SHOOTING START Connect the phone to network Equipment and setup call Setup 1KHz tone out Does the sine wave appear Change the main board at C2604 ? Does the sine wave appear Resolder or change N2603 at R2607 ? Does the sine wave appear Change the main board at R2621 ?
  • Page 113 4. TROUBLE SHOOTING C2604 R2621 R2607 N2603 Pin 4 CN963 - 114 -...
  • Page 114 4. TROUBLE SHOOTING Measured 1khz Sine Wave Signal - 115 -...
  • Page 115 4. TROUBLE SHOOTING C. Microphone (Voice call, Voice Recorder, Video Recorder) • Microphone Signal Flow – MIC is enable by MIC Bias – MICBAS, MICIP, MICIN signals to ABB ( Vincenne ) • Check Points – Microphone bias – Audio signal level of the microphone –...
  • Page 116 4. TROUBLE SHOOTING START Check the MIC b ias level at the pad of MIC+(X2603) Check the signal level Is the level o f M IC+ AND MIC- at C2615 at the putti ng 2.4V ? Audio signal in MIC Resolder C2615, C2617, C2616 A few hundred of m V and try again.
  • Page 117 4. TROUBLE SHOOTING C2616 C2617 C2615 - 118 -...
  • Page 118 4. TROUBLE SHOOTING Measured Some Noise Signal - 119 -...
  • Page 119 4. TROUBLE SHOOTING D. Headset Receiver (Voice call, Video Telephony, MP3) START Connect the phone to network Equipment and setup call Setup 1KHz tone out Insert Head set. Does the level of R3381 Does the Headset ico n under 0.5Volt ? display on the main LCD? Does the level of R2613 over 2.0Vo lt ?
  • Page 120 4. TROUBLE SHOOTING E. Headset MIC(Voice call, Video Telephony) START Insert Head set. Does the level of R3397 Does t he Headset ico n under 0.5Volt ? display on the main LCD? Does the level of R2613 over 2.0Vo lt ? Check the signal level at R3397 at the putting Change t he main B'd...
  • Page 121 4. TROUBLE SHOOTING R3381 X2602 C2612 C2610 R2613 C2619 C2611 R3397 C2613 - 122 -...

  • Page 122: Charger Trouble Shooting

    4. TROUBLE SHOOTING 4.13 Charger Trouble Shooting Figure. 13. Main Battery Charging Path • Charging Procedure - Connecting TA and Charger Detection - Control the charging current by AB2000(Vincenne) - Charging current flows into the battery • Check Point - Connection of TA - Charging current path - Battery •...
  • Page 123 4. TROUBLE SHOOTING start start Check the pin and battery Check the pin and battery connect terminals of I/O connect terminals of I/O connector connector Connection OK? Connection OK? Change I / O connector Change I / O connector Change TA Change TA I s the TA voltage 5.2V? I s the TA voltage 5.2V?
  • Page 124 4. TROUBLE SHOOTING Figure. 15. Main Board - I/O connector and FET - 125 -...

  • Page 125: Rf Component

    4. TROUBLE SHOOTING 4.14 RF Component N1331 N1330 Z1100 Z1110 Z1420 Z1400 N1400 N1620 B1501 N1101 Z1500 B1770 N1700 Figure 4-1. RF component (Top) Reference Description Reference Description B1501 Temperature Sensor N1700 WCDMA TX IC B1770 Crystal Z1100 DCS RX SAW N1101 GSM ADC Z1110...
  • Page 126 4. TROUBLE SHOOTING W1001 N1002 N1650 N1000 N1630 V1001 N1850 N1300 Figure 4-2. RF component (Bottom) Reference Description Reference Description N1000 Ant. SW Module N1650 Isolator N1002 Duplexer N1850 Regulator N1300 GSM PAM V1001 Transistor N1630 WCDMA PAM W1001 Test Connector - 127 -...

  • Page 127: Procedure To Check

    4. TROUBLE SHOOTING 4.15 Procedure to check start Oscilloscope setting 1. Check Power Source Block 2. Check VCXO Block 3. Check Ant. SW Module Agillent 8960 : Test mode(WCDMA) Ch. 9750 (Uplink) Ch. 10700 (Downlink) 4. Check WCDMA Block Agillent 8960 : Test mode(GSM) Ch.

  • Page 128: Checking Common Power Source Block

    4. TROUBLE SHOOTING 4.16 Checking Common Power Source Block Figure 4-3. Common Source Block(Bottom) - 129 -...

  • Page 129: Step 1

    4. TROUBLE SHOOTING 4.16.1 Step 1 Check VBATI (R1850) LP39 81 I LD- 2.8 Figure 4-4. Regulator Block 1 Check Point R2215 R2216 ( C3215 ) Step 1 Figure 4-5. Power Source Block 5 Check Point (C3215) in Power Source Block 5 To Check Power source Check Soldering 3.7V OK ?

  • Page 130: Step 2

    4. TROUBLE SHOOTING 4.16.2 Step 2 Step 2 Check VBATI (R1850) in Regulator Block 1 to 3.7V OK ? Check if main power source input or not See The Step 3 Check (R2215 & R1805) in Block 1, 5 to check Change the Board Short? inner line connection...

  • Page 131: Step 3

    4. TROUBLE SHOOTING 4.16.3 Step 3 VBATI ( R1326) GSM PAM L1 300 Figure 4-6. GSM PAM Block 2 Step 3 Check VBATI (R1326) in GSM PAM Block 2 to Check if main power See The Step 4 3.7V OK ? source input or not Check L1300 to 3.7V OK ?

  • Page 132: Step 4

    4. TROUBLE SHOOTING 4.16.4 Step 4 VBATI (R163 1) WCDMA PAM Figure 4-7. WCDMA PAM Block 3 R22 16 Check Po int ( C32 15 ) R22 15 Figure 4-7-1. PAM-Power Source - 133 -...
  • Page 133 4. TROUBLE SHOOTING Step 4 Check R1631 in WCDMA 3.7V OK ? PAM block See the Next Page Change the Board Shor t? Check Soldering (R2215 & R2216) In Power Source Block - 134 -...
  • Page 134 4. TROUBLE SHOOTING VCCB VCCA (R 181 1) (R 181 0) Figure 4-8. Power for Radio ASIC Ingela (N1100) R1810 VDD_A VCCA Vincenne R1811 VDD_B VCCB (N2000) C1810 C1811 C1802 4.7u Wopy (N1400) 2012 2012 2.75V OK ? Check Poin t VCCA(R1810) Change the Board 2.75V OK ?

  • Page 135: Checking Regular Part

    4. TROUBLE SHOOTING 4.16.5 Checking Regular Part LP3981ILD-2.8 Reg ulat or V_ wi vi_B EXTLDO (N1700) ( R1851) V_ wi vi_A (N1700) Figure 4-9. Regulator Block Figure 4-10. Regular Circuit Diagram Check Poin t (R1825) Change the Board 2.8V OK ? Point High (R1826)

  • Page 136: Checking Vcxo Block

    4. TROUBLE SHOOTING 4.17 Checking VCXO Block The reference frequency (13MHz) from B1770 (Crystal) is used WCDMA TX part, GSM part and BB part. Therefore you have to check below 4 point. Check 3 Check 4 Check 1 Chec k 2 Figure 4-12.
  • Page 137 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Figure 4-14. Test Point (Crystal Part) Figure 4-15. Schematic of the Crystal Part Figure 4-16. 13MHz at B1770.3 - 138 -...
  • Page 138 4. TROUBLE SHOOTING Check 2,3 13MHz at WCDMA TX part and GSM part N1770.B1 N1770.C1 N1100.K9 Figure 4-17. Test point (13MHz at TX Part) Figure 4-18. 13MHz at N1770.B1 and N1100.K9 - 139 -...
  • Page 139 4. TROUBLE SHOOTING Check 4. 13MHz at BB part N1400.C1 Figure 4-19. Test Point (13MHz at BB Part) Figure 4-20. Schematic (13MHz at BB Part) Figure 4-21. 13MHz at N1400.C1 - 140 -...
  • Page 140 4. TROUBLE SHOOTING - 141 -...

  • Page 141: Checking Ant. Sw Module Block

    4. TROUBLE SHOOTING 4.18 Checking Ant. SW Module Block ANTSW2 LMSP -00 64 (N1 000 ) ANT SW 1 ANTSW0 ANTSW3 V10 01 VCCB (C101 0) Figure 4-20. Antenna Switch Block(Bottom) - 142 -...

  • Page 142: Checking Antenna Switch Block Input Logic

    4. TROUBLE SHOOTING 4.19 Checking Antenna Switch Block input logic 4.19.1 Mode Logic by TP Command EGSM Tx EGSM Rx MODE=0 MODE=0 SWTX=1, 64, 7,1 024 ,1 SWRX=64 ,10 24 ,2 ANTSW1 ANTSW2 Hi High ANTSW3 DCS Tx DCS Rx MODE=2 MODE=2 SWTX=1,699,0,1024,...
  • Page 143 4. TROUBLE SHOOTING WCDMA Mode MODE=4 WTXC=9750,0,1, SYCT=1 07 00 TXGN=1,43 ANTSW1 ANTSW2 ANTSW3 Band ANTSW0 ANTSW1 ANTSW2 ANTSW3 EGSM Tx EGSM Rx DCS Tx DCS Rx WCDMA Table 4-1. Antenna Switch Module Logic - 144 -...

  • Page 144: Checking Switch Block Power Source

    4. TROUBLE SHOOTING 4.19.2 Checking Switch Block power source ❈ Before Checking this part, must check common power source (through Vincenne) part TP Command MODE=0 SWRX= 64,1024,2 Open? C heck Soldering . It is necessary to c heck shor t co nditi on. Using Tester, Che ck 4 resistor ANTSW0(R1 003),ANTSW1( R10 04), Check soldering...
  • Page 145 4. TROUBLE SHOOTING A. EGSM Rx Mode EGSM Rx MODE=0 SWRX= 64, 10 24 ,2 ANTSW1 ANTSW2 ANTSW3 Figure 4-21. EGSM Rx Mode EGSM Rx 4. 4. 1 part Check Try 4.4.1 part Logic OK? See the Next mode Change the Board (EGSM Tx Mode) - 146 -...
  • Page 146 4. TROUBLE SHOOTING B. EGSM Tx Mode EGSM Tx MODE=0 SWTX= 1,6 4, 7, 102 4, 1 ANTSW1 ANTSW2 High ANTSW3 Figure 4-22. EGSM Tx Mode EGSM Tx Try 4.4.1 part 4.4.1 part Check OK? Logic OK? See the Next mode ANTSW1 : Low Change the Board (DCS Tx Mode)
  • Page 147 4. TROUBLE SHOOTING C. DCS Rx Mode DCS Rx MODE= 2 SWRX=6 99 ,1 02 4,2 High ANTSW1 High ANTSW2 ANTSW3 Figure 4-23. DCS Rx Mode DCS Rx 4.4. 1 p ar t Check Try 4.4.1 part Logic OK? See the Next mode Change the Board ( DCS Tx Mode) - 148 -...
  • Page 148 4. TROUBLE SHOOTING D. DCS Tx Mode DCS Tx MODE=2 SWTX= 1,6 99 ,0 ,1 02 4,1 ANTSW1 High ANTSW2 ANTSW3 Figure 4-24. DCS Tx Mode DCS Tx 4.4. 1 p ar t Check Try 4.4.1 part Logic OK? Change the Board WCDMA Mode - 149 -...
  • Page 149 4. TROUBLE SHOOTING E. WCDMA Mode WCDMA Mode MODE=4 WTXC=9 75 0, 0,1, 0 SYCT= 107 00 TXGN=1,4 3 ANTSW1 ANTSW2 ANTSW3 Figure 4-25. WCDMA Mode WCDMA 4.4. 1 p ar t Check Try 4.4.1 part Logic OK? Input Signal and Power to Change the Board Antenna Switch Block is OK.

  • Page 150: Checking Wcdma Block

    4. TROUBLE SHOOTING 4.20 Checking WCDMA Block start 1. Check VCXO Block 2. Check Ant. SW Module 3. Chec k Contr ol Signal 4. Check RF Tx Level 5. Check PAM Block 6. C heck Rx IQ 7. C heck RF Rx Level Redo wnload SW, Cal - 151 -...

  • Page 151: Checking

    4. TROUBLE SHOOTING 4.20.1 Checking Refer to 4.4 4.20.2 Checking Ant. SW module Refer to 4.5 4.20.3 Checking Control Signal First of all, you have to check control signal. (data, clk, strobe) TP 1402(CLK) TP 1402(DATA) TP 140 2(STROBE) Figure 4-28. Test Point (Control Signal) Figure 4-29.
  • Page 152 4. TROUBLE SHOOTING Figure 4-30. Connection for Checking Control Signal - 153 -...
  • Page 153 4. TROUBLE SHOOTING TP1403( STRO BE) TP1401(DATA) TP1402( CLK) TP1403( STRO BE) TP1401(DATA) TP1402( CLK) Figure 4-30. Control signal - 154 -...

  • Page 154: Checking Rf Tx Level

    4. TROUBLE SHOOTING 4.20.4 Checking RF TX Level Check 3 N1002.Ant Check 1 W1001 Check 2 N1000.8 Check 5 N1650.In Check 4 Check 6 N1650.Out N1630.21 Check 7 Z1500.2 Figure 4-31. Test Point (RF TX Level) - 155 -...
  • Page 155 4. TROUBLE SHOOTING Figure 4-32. Connection for Checking RF TX Level - 156 -...
  • Page 156 4. TROUBLE SHOOTING To verify that the phone fulfils requirements on maximum output power. - 157 -...

  • Page 157: Checking Pam Block

    4. TROUBLE SHOOTING 4.20.5 Checking PAM Block VBATI Rosalie (R162 9) WD CDCREF (R1621) WPAREF (R 1617) WCDMA PAM(N1630) Wivi in put (R1605 ) WPA( R1630) fro m Rosalie Step1: Check PAM(N1630) control signal from N2000 Step2: Check PAM(N1630) control signal from N1620 ❈...
  • Page 158 4. TROUBLE SHOOTING TP Command -mode =4 -Wtxc=9750,0,1,0 -Syct=10700 -Txgn=1,43 -TFTI=10700 Step1: Check PAM control signal from N2000 Mean Value Check R16 17 To Check PAM control Change the Board 2.4V ? signal from Vi nce nne (WP A REF) Before Change board, Check soldering(R1617) See the Step 2...
  • Page 159 4. TROUBLE SHOOTING TP Command -mode =4 -Wtxc=9750,0,1,0 -Syct=10700 -Txgn=1,43 -TFTI=10700 Step2: Check PAM control signal from DC/DC converter(N1620) Check R1603 Mean Value To Check PAM VCC BIAS fr om DC/ DC conver tor 2.4V ? (V CC WPA ) Check The DC/ DC convertor(N1620) Part Change the PAM...
  • Page 160 4. TROUBLE SHOOTING TP Command -mode =4 - Wtxc=9750,0,1,0 - Syct=10700 - Txgn=1,43 -TFTI=10700 Download the SW Level 23dBm ? < -10 dBm? & Calibrate Check Duplex output (C1012) To Check PAM output WCDMA PAM i s OK Level Check the WCDMA RF See t he Next page >2 dBm Tx Chip(Wivi)

  • Page 161: Checking Rx I,Q

    4. TROUBLE SHOOTING 4.20.6 Checking RX I,Q To verify the RX path you have to check the pk-pk level and the shape of the RX I,Q. N1400.A7 (RXQA) N1400.A8 (RXQB) N1400.A9 (RXIA) N1400.A10 (RXIB) Figure 4-33. WCDMA RF RX IC (Top) Figure 4-34.
  • Page 162 4. TROUBLE SHOOTING Figure 4-36. RX I, Q signal - 163 -...

  • Page 163: Checking Rx Level

    4. TROUBLE SHOOTING 4.20.7 Checking RX Level Check 2 Check 3 N1400.H1 N1400.B1 Checkt 1 N1002.Ant Figure 4-37. Peak level at N1400.B1 Figure 4-38. Connection for Checking RX Level - 164 -...
  • Page 164 4. TROUBLE SHOOTING - 165 -...

  • Page 165: Checking Gsm Block

    4. TROUBLE SHOOTING 4.21 Checking GSM Block start 1. Check Regulator Circuit 2. Check VCXO Block 3. Check Ant. SW Modu le 4. Check Control Signal 5. Check RF Tx Path 6. Check RF Rx Path Redow nload SW, Cal - 166 -...

  • Page 166: Checking Regulator Circuit

    4. TROUBLE SHOOTING 4.21.1 Checking Regulator Circuit Refer to chapter 4.3 Checking Common Power Source Block. IF you already check this point while Checking Common Power Source Block, You can skip this test. 4.21.2 Checking VCXO Block Refer to chapter 4.4 Checking VCXO Block. IF you already check this point while Checking VCXO Block, You can skip this test.

  • Page 167: Checking Control Signal

    4. TROUBLE SHOOTING 4.21.4 Checking Control Signal Test Program Script MODE=0 VCCA SWTX=1,64,7,1024,1 (C1330) VC CA Vtune (L1200) (C1223) VCCA LPF block (L1120) VCCA (L1202) TXON (R1333) RADCLK RADSTR RADDAT (TP1201) (TP1203) (TP1202) RADSTR TXON RADCLK Vtune RADDAT Figure 4-39. GSM RF Control signal - 168 -...
  • Page 168 4. TROUBLE SHOOTING Check TP1201,TP1202,TP1203 Check if there is any major difference. Check the short status between TP1201~TP1203 Refer to left side of Figure 4-39 Simiar? Short? Redownload SW Change the board Check R1333,C1223. Check if there is any major difference. Check voltage of L1120,L1200,L1202,R1335 Refer to right side of Figure 4-39...

  • Page 169: Checking Rf Tx Path

    4. TROUBLE SHOOTING 4.21.5 Checking RF Tx Path A. GSM Tx path Level Figure 4-40. GSM/DCS Tx Path Level - 170 -...
  • Page 170 4. TROUBLE SHOOTING Figure 4-41. Test Point of GSM/DCS Tx path - 171 -...
  • Page 171 4. TROUBLE SHOOTING B. GSM Tx Output Level Check Figure 4-42. GSM Tx Level at 1 Test Program Script 1. GSM Tx 2. DCS Tx MODE=0 MODE=2 SWTX=1,64,5,1024,1 SWTX=1,699,0,1024,1 v. Agilent 8960 setting : GSM BCH+TCH m ode v. Oscilloscope setting Check GSM/DCS output power at Check if there is any Major difference.
  • Page 172 4. TROUBLE SHOOTING C. GSM RF Transceiver IN/OUT Signal Check DCS Tx GSM T x (R1341) (R1338) N1331 N1330 MODA MODA (R1213) GSM Tx (L1330) MODB (R1212) DCS Tx MODB (L1331) MODC (R1211) MODD (R1210) Figure 4-43. GSM Tx MODE signal Check Mode(A/B/C/D)signal at Resoldering MODE block Simiar?
  • Page 173 4. TROUBLE SHOOTING D. GSM PAM Check GSM Tx (C1341) block DCS Tx (C1352) Vapc (C1327) TXON TXON Vapc (GS M) Vapc (DCS) Figure 4-44. GSM/DCS Tx control signal Check Vapc level. Check if there is any Major difference. V apc > 1 .5 V ? Resoldering APC block Refer to Figure...

  • Page 174: Checking Rf Rx Path

    4. TROUBLE SHOOTING 4.21.6 Checking RF Rx Path A. GSM Rx path Level Figure 4-45. GSM/DCS Rx Path Level - 175 -...
  • Page 175 4. TROUBLE SHOOTING Z1110 Z1100 N1100 N1101 Test Program Script 1. GSM Rx 2. DCS Rx MODE=0 MODE=2 SWRX=64,1024,2 SWRX=699,1024,2 v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) v Oscilloscope Setting - 176 -...
  • Page 176 4. TROUBLE SHOOTING B. GSM I/Q Signal Check Qdata Idata DCLK (TP1142) (TP1141) (TP1143) (R1103) (R1104) VDIG_HERTA R1150 (R1105) (R1106) I Data Q Data DCLK Figure 4-46. Herta IQ data and DCLK Figure 4-47. Ingela IQ signal - 177 -...
  • Page 177 4. TROUBLE SHOOTING Figure 4-48. Ingela IQ signal Check GSM/DCS Rx IQ data at 1. Check if there is any Major Similar? VDIG_HERT A= 2.7V? Reso ldering R1150 difference. Refer to Figure 4-46. Redownload SW Check GSM/DCS Rx IQ signal 2. Resoldering VCCA block Refer to Figure 4-47.
  • Page 178 4. TROUBLE SHOOTING C. GSM RF Level Check Z1100 Z1110 Figure 4-49. GSM/DCS Rx Path v Agilent 8960 Setting CW Mode GSM : -50dBm@Ch65(948MHz) DCS : -50dBm@Ch700(1842.8MHz) Check GSM/DCS Rx signal level at GSM:-51.5dBm Change Ant. SW module (N1000) DCS:-51.5dBm GSM Rx path OK.

  • Page 179: Block Diagram

    5. BLOCK DIAGRAM 5. BLOCK DIAGRAM 5.1 GSM & WCDMA RF Block UMTS UMTS UMT S IF Filter UMT S IF Filter UMT S RF Filter UMT S RF Filter Z1420 Z1420 Z1400 Z1400 Du plex er Du plex er N1002 N1002 UMT S Receiver...
  • Page 180 5. BLOCK DIAGRAM Block Ref. Name Part Name Function Comment N1000 LMSP-0064 Switch Band select W1001 KMS-507 Test Connector Calibration, etc Common B1770 TSX-8A Crystal Reference –13M N1002 DFYK61G95LBNCB Duplexer LZT-108- N1400 Receiver 5323(WOPY) Z1400 LK20A RX RF Filter Z1420 TMX-M453 RX IF Filter WCDMA...

  • Page 181: Interface Diagram

    5. BLOCK DIAGRAM 5.2 Interface Diagram 13M _ 13M _ M _M C M _M C M CLK M CLK Crystal Crystal W opy W opy Bus _W Bus _W B1770 B1770 13M Re 13M Re Ref. Ref. N1400 N1400 32k RTC 32k RTC I/ Q_WR...
  • Page 182 5. BLOCK DIAGRAM Schematic_Signal Function Block Name Function Name 13M_MCLK MCLK Main clock to BB 13M_R XOOA/XOOB Ref for PLL RFLO RFLO/RFLOBAR RF LO Generation IFLO IFLO/IFLOBAR IF LO Generation RTCCLK Real Time W-RF RX WCDMA_RX RX RF signal W-RF TX WCDMA_TX TX RF signal G/D-RF RX...

  • Page 183: Detailed Interface Signal

    5. BLOCK DIAGRAM 5.3 Detailed Interface Signal Baseband Commo n ANTSW [3..0] ANTS W [3..0] Reg. O n/Off for S wi tch/ GS M I2CSDA (Combi ne to Vince nne) I2C D A T I2CSCL (Combine to Vince nne ) I2C C LK MCLK SYSCLK2...
  • Page 184 5. BLOCK DIAGRAM VBAT VBAT Vincenne Vincenne 0. 1ohm 0. 1ohm VRTC VRTC PASEN S E+ PASEN S E+ V BATI V BATI V DD_LP V DD_LP V DDRTC V DDRTC V DDBUF V DDBUF (1.5V ) (1.5V ) V BAT_A V BAT_A V DIG V DIG...

  • Page 185: Disassembly Instruction

    6. DISASSEMBLY INSTRUCTION 6. DISASSEMBLY INSTRUCTION - 186 -...
  • Page 186 6. DISASSEMBLY INSTRUCTION - 187 -...
  • Page 187 6. DISASSEMBLY INSTRUCTION - 188 -...
  • Page 188 6. DISASSEMBLY INSTRUCTION - 189 -...
  • Page 189 6. DISASSEMBLY INSTRUCTION - 190 -...
  • Page 190 6. DISASSEMBLY INSTRUCTION - 191 -...
  • Page 191 6. DISASSEMBLY INSTRUCTION - 192 -...
  • Page 192 6. DISASSEMBLY INSTRUCTION - 193 -...

  • Page 193: Download

    7. DOWNLOAD 7. DOWNLOAD The Purpose of Downloading Software • To make a phone operate at the first manufacturing – A phone = Hardware + Software – A phone cannot operate with hardware alone. – The hardware with the suitable software can operate properly. •...
  • Page 194 7. DOWNLOAD U81X0 Download (1) – FlashRW configuaration 1. Execute FLASHRW.exe. 2. Press the “Global Settings” on the top menu to configure FlashRW environment - 195 -...
  • Page 195 You can use browse button to select Loader File. You must select only U8120_CXC1325712_R2H(R5E_Signed by cust_brown).pldr for U8120. You may select any loader of 3 loaders in loader folder for U8110. Loader File is provided with FlashRW. 4. Select Port configurations for both RS232 Port and USB Port.
  • Page 196 7. DOWNLOAD U81X0 Download (3) – Phone Model Selection 1. Press Button for Model. 2. Select Model to download images - 197 -...
  • Page 197 7. DOWNLOAD U81X0 Download (4) – Download file selection 1. Press “Add” button to select LGE SSW files to download. 2. Press “Add1” button to select LGE GDFS file to download. Click to select file <Before Select> U81X0 download file is selected <After Select>...
  • Page 198 7. DOWNLOAD U81X0 Download (5) – Connect & Download 1. Click on connector icon ( ) to connect to the phone Check the Dialog Box that say “Please,switch on the target”. 2. Connect the phone to PC via Cable for Downloading. Phone should be turned off.
  • Page 199 7. DOWNLOAD U81X0 Download (6) – USB Driver Install 1. If you use FlashRW Tool firstly, Error will happen because of USB Driver uninstalled. You have to do FlashRW USB Driver Installation only at the first time of installation - 200 -...
  • Page 200 7. DOWNLOAD U81X0 Download (7) – USB Driver Install 2. Push “the Next Button” in Found New Hardware Wizard 3. Select “Search for a suitable driver for my device” in Found New Hardware Wizard - 201 -...
  • Page 201 7. DOWNLOAD U81X0 Download (8) – USB Driver Install 4. Select “Specify a location” in Found New Hardware Wizard 5. Push “the Browse Button” , and then select “USB driver Information file” This File is provided with FlashRW. - 202 -...
  • Page 202 7. DOWNLOAD U81X0 Download (9) – USB Driver Install 6. Push “the Next Button” in Found New Hardware Wizard 7. Push “the Finish Button” in Found New Hardware Wizard - 203 -...
  • Page 203 7. DOWNLOAD U81X0 Download (10) – USB Driver Install 8. Close FlashRW.exe 9. Remove & Insert Main battery to reset the phone % This action for USB Driver Install is done only at the first time of installation If you want to download Software, just do as same as U81X0 Download (5) – Connect & Download says - 204 -...
  • Page 204 7. DOWNLOAD U81X0 Download (11) – Connect & Download < While Downloading > < After Downloading finished > - 205 -...
  • Page 205 7. DOWNLOAD U81X0 Download (12) - Trouble shooting • Check these questions when trouble happens. 1. Check if UART & USB Port configuration is right. 2. Do not change RS-232 baud rate(115200BPS). It is fixed and never changed. 3. Check if UART & USB Cable is connected. - 206 -...

  • Page 206: Calibration

    8.1 General Description This document describes the construction and the usage of the software used for the calibration of LG’s GSM/GPRS/WCDMA Multimedia Mobile Phone (U8110). The calibration menu and their results are displayed in PC terminal by Mobile phone. This calibration software includes GSM, DCS, WCDMA Band RF partscalibration and Battery calibration.

  • Page 207: Calibration Explanation

    8. CALIBRATION 8.3 Calibration Explanation 8.3.1 Overview In this section,it is explained each calibration item in the XCALMON.Also the explanation includes technical information such as basic formula of calibration and settings for key parameters in each calibration procedure. At first,when any of calibration is done,the results are displayed in the XCALMON result window and the result of calibration will be stored in GDFS(Global Data Flash Storage).

  • Page 208: Egsm 900 Calibration Items

    8. CALIBRATION 8.3.3 EGSM 900 Calibration Items A. MOD-A(MD bit) Delay Calibration - Pur pose The procedure is designed to calibrate the timing alignment between the MODA-D signals and the reference signal (13 MHz).It also ensures that the MOD signals have stable values when they are clocked into the divider of the Phase-Locked Loop (PLL).
  • Page 209 8. CALIBRATION B. RXVCO Varactor Operating Point Calibration - Pur pose To adjust the varactor diode to a pre-determined operating point,so that the loop voltage of the RXVCO (measured with an ADC in AB 2000) is within the valid range. This is necessary to secure that all RX channels can be reached.
  • Page 210 8. CALIBRATION - Procedure Proposal 1. Put the ME in switched TX mode on mid channel in frequency interval 11 for EGSM (with random modulation). 2. Measure the RMS phase error at the RF connector. 3. Tune the phase detector current (IPHD)until the phase error is minimized.If two IPHD settings gave the same RMS,choose the lowest value.Measure 10 bursts for each value.
  • Page 211 8. CALIBRATION Acquire the following VCXO (13 MHz)frequencies: fmin =13 MHz VCXO-frequency @DAC3=1 fmid =13 MHz VCXO-frequency @DAC3=1024 fmax =13 MHz VCXO-frequency @DAC3=2047 Note that it is necessary to translate the measured RF-frequency (EGSM,DCS,or W- CDMA)to the 13 MHz VCXO-frequency. 3.
  • Page 212 8. CALIBRATION Parameter Target Full Power (dBm) Tolerances (dB) PL 5 33.0 +0.5 – 1.0 PL 6 31.0 ±0.3 PL 7 29.0 ±0.5 PL 8 27.0 ±0.5 PL 9 25.0 ±0.5 PL 10 23.0 ±0.5 PL 11 21.0 ±0.5 PL 12 19.0 ±0.5 PL 13...

  • Page 213: Dcs 1800 Calibration Items

    8. CALIBRATION 4. Switch off the LNA, using the command FREC=3,0,1, and measure the RSSI value. 5. Calculate the difference between on and off (converting the result to‚ real dB attenuation) and store the result in GD_MPH_RX_AGC_Parameters_Band. 8.3.4 DCS 1800 Calibration Items A.
  • Page 214 8. CALIBRATION - Procedure Proposal 1. Put the ME in switched TX mode on mid channel in frequency interval 11 for DCS (with random modulation). 2. Measure the RMS phase error at the RF connector. 3. Tune the phase detector current (IPHD) until the phase error is minimized. If two IPHD settings gave the same RMS, choose the lowest value.
  • Page 215 8. CALIBRATION 3. To avoid yield problems with the power template and switchingtransients spectrum a margin to the compression point of the PA should be observed. However, the output power must be kept within the tolerances specified in Table 8-5. 4.

  • Page 216: Wcdma Calibration Items

    8. CALIBRATION E. RSSI Calibration - Purpose This procedure calibrates an absolute power level on the antennaagainst a corresponding RSSI value. This value together with a pre-defined slope figure is then used to calculate the RSSI value of an arbitrary received antenna power. The formula y=kx+m is used. (Where k is the slope value, x the RSSI value, y the actual level, and m is an offset value).
  • Page 217 8. CALIBRATION 2. Measure the relative power between the 1950 MHz carrier and 1949.04 MHz at the antenna output. Jump to step 6 if the requirement is met. 3. Step RECDCI from 0 to 3. Set TXON = 0 and wait 1 ms before changing RECDCI from 3 to 5. Set TXON = 1, wait 1 ms and continue with stepping from 5 to 7.
  • Page 218 Settings and limitations are also used from maximum output calibration. 1. Perform measurements (1) VGA behavior in LG (Low Gain) mode. PABias should not be offset and RFBIAS should be 1. (2) VGA behavior in MG (Medium Gain mode). PABias should not be offset and RFBIAS should be 1.
  • Page 219 Interpolate the gain steps in between the averaged measured values. (7) Size of step between LG/MG and MG/HG and between each setting of RFBIAS (1-7). The main purpose is to find the relative difference at different frequencies. Distribute with equal frequency offset except if there are known ‚worst-case frequencies.
  • Page 220 8. CALIBRATION E. TX Open Loop Power Control Calibration - Purpose The purpose of the calibration of open loop power control is to store parameters for the Open Loop Power Control algorithm. This is a pure off-line calculation. Use data (positions and output power, in dBm) from table 0.
  • Page 221 8. CALIBRATION F. RX LPF Bandwidth Calibration - Purpose This procedure calibrates the LPF bandwidth. The bandwidth of the channel filters will affect system parameters as reception sensitivity and adjacent channel selectivity. The procedure also verifies that the IF-filter is properly matched. Figure 8-3.
  • Page 222 8. CALIBRATION F. RX LNA Gain Switch and AGC Hysteresis Calibration - Purpose This procedure calibrates the gain correction parameter of Ak in the AGC algorithm between GLNA=0 and GLNA=1; that is, it establishes the gain difference in the LNA between high gain mode and low gain mode.
  • Page 223 8. CALIBRATION G. RX AGC Gain Max and RX RSSI Calibration - Purpose To prevent wind up in AGC algorithm, this procedure calibrates the absolute power levels at the antenna connector against RSSI values and the maximum gain setting for AGC. Reference [6] specifies that the reporting range of the RSSI should be between -100 dBm to -25 dBm.

  • Page 224: Baseband Calibration Item

    8. CALIBRATION 8.3.6 Baseband Calibration Item A. Battery Voltage Calibration - Purpose Calibrates the voltage table for the power management functionality. Some voltage measurements in the remaining test will be done with calculated voltage levels from this test. - Procedure Proposal 1.

  • Page 225: Program Operation

    8.4 Program Operation 8.4.1 XCALMON Program Overview When you try to calibrate the U8110 mobile phone, you should make a configuration of calibration environment like Figure7-1. And if you finish making configuration, please execute the XCALMON program. Running the XCALMON program, you should show XCALMON program window like Figure7-5.

  • Page 226: Xcalmon Icon Description

    When you click the calibration window icon ”C”, then you should see the calibration tree window. That will be shown all calibration items. If you want to calibrate U8110 mobile phone for all calibration items, you should select “Calibration” and push “F4” button in your keyboard.
  • Page 227 8. CALIBRATION Figure 8-7. XCALMON Calibration Tree Window (OUTPUT Tab) Figure 8-8. XCALMON Calibration Tree Window (INSTRUMENT Tab) - 228 -...
  • Page 228 C. ITP Starting Window Using Production Loader When you click the ITP starting window icon”L”, then you should see the ITP starting window. That dialog window just wait for power-on of U8110 mobile phone. When it will occur power-on, it automatically start ITP running.

  • Page 229: Calibration Procedure

    Click the “L” icon, then you will see the ITP start window like Figure7-10. When you will turn on the U8110 mobile phone, the production loader will be downloaded automatically like Figure7-11 and then it will execute the ITP at once.
  • Page 230 8. CALIBRATION Figure 8-11. Production Loader Downloading Figure 8-12. ITP Start Complete Window - 231 -...

  • Page 231: Calibration Result Message

    8. CALIBRATION C. Calibration Start Using XCALMON If you want to calibrate U8110 mobile phone, click the calibration icon “C”. And then you will see the calibration tree window like Figure7-6. To start calibration, you should select “Calibration” item and push “F4” button in your keyboard.
  • Page 232 8. CALIBRATION Figure 8-14. Calibration FAIL Message Window Figure 8-15. Calibration Result from OUTPUT Tab View - 233 -...
  • Page 233 8. CALIBRATION Figure 8-16. Calibration Result from STATUS Tab View - 234 -...

  • Page 234: Circuit Diagram

    VOUT R1850 BYPASS VOUT_SE GND1 C1850 C1852 C1851 0.1u 0.033u 2012 Engineer: Engineer: LG ELECTRONICS INC. SG Kang 3G HANDSETS LAB. Drawn by: Drawn by: DEVELOPMENT GROUP 1 SG Kang R&D CHK: R&D CHK: Size: Size: TITLE: TITLE: ANT SW to ANT...
  • Page 235 WCLK C1720 WSTR 5600p R1431 GPRFCTRL R2108 CLKREQ FROM MARITA SIDE FOR POWER SAVING Engineer: LG ELECTRONICS INC. SG Kang 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 SG Kang R&D CHK: Size: TITLE: UMTS RX (WOPY) DOC CTRL CHK: 12 1 8 A U8100 PT V1.3 Staggered AMD...
  • Page 236 R1711 R1710 4.7K C1712 C1710 C1711 R1703 V_wivi_B 150p 3300p Engineer: LG ELECTRONICS INC. SG Kang 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 SG Kang R&D CHK: Size: TITLE: DOC CTRL CHK: UMTS TX (WIVI) to ISOLATOR 12 1 8 A U8100 PT V1.3 Staggered AMD...
  • Page 237 C1220 C1224 C1222 C1223 C1203 C1202 0.01u 1200p 560p 330p 0.01u Engineer: LG ELECTRONICS INC. JS Joo 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 JS Joo R&D CHK: Size: TITLE: GSM/DCS (INGELA) DOC CTRL CHK: 12 1 8 A U8100 PT V1.3 Staggered AMD...
  • Page 238 C3052 2.2u 4.7u 2.2u 4.7u USBSENSE 2012 2012 R2233 IRDA REGULATOR USB REGULATOR Engineer: LG ELECTRONICS INC. TAE-SUNG, HA 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 TAE-SUNG, HA R&D CHK: Size: TITLE: BB MAIN PCB DOC CTRL CHK: VINCENNE 12 1 8 A U8100 PT V1.3 Staggered AMD...
  • Page 239 C3137 50V 1608 IrDA 0.47u 1608 KEY I/F PCM I/F VPPFLASH SHIELD LEDK LEDA Engineer: LG ELECTRONICS INC. SUNG-JU, YOU 3G HANDSETS LAB Drawn by: SIR TRANCEIVER DEVELOPMENT GROUP1 SUNG-JU, YOU SD(L:ACTIVE, H:SHUTDOWN) R&D CHK: Size: TITLE: BB MAIN PCB...
  • Page 240 USBUF01W6 C3215 C2208 R2501 3216 1608 USBPUEN CAMERA ROTATION DETECTOR UARTTX1 USB FILTER Engineer: LG ELECTRONICS INC. S .Y SEOK 3G HANDSETS LAB. I/O CONNECTOR Drawn by: DEVELOPMENT GROUP1 S .Y SEOK R&D CHK: Size: TITLE: BB MAIN PCB DOC CTRL CHK:...
  • Page 241 TP2119 UART_TX CPU_IRQ0 TP2116 UART_RX CPU_CLKOUT TP2120 R2120 C2215 0.1u R2400 Engineer: LG ELECTRONICS INC. MYUNG-LAE, CHO 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 MYUNG-LAE, CHO R&D CHK: Size: TITLE: BB MAIN PCB DOC CTRL CHK: WANDA 12 1 8 A U8100 PT V1.3 Staggered AMD...
  • Page 242 VDIG_2.8V HSMR-C191 R1130 FOLDER_DET 100K 0.1u 0.1u FOLDER OPEN DETECTOR KEY_LED- Engineer: LG ELECTRONICS INC. KEYPAD BACKLIGHT BLUE LED 3G HANDSETS LAB. Drawn by: DEVELOPMENT GROUP 1 R&D CHK: Size: TITLE: U8100 KEY PT V1.3 DOC CTRL CHK: BB KEY PAD PCB...

  • Page 243: Pcb Layout

    10. PCB LAYOUT - 244 -...
  • Page 244 10. PCB LAYOUT - 245 -...
  • Page 245 10. PCB LAYOUT - 246 -...
  • Page 246 10. PCB LAYOUT - 247 -...

  • Page 247: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW - 248 -...

  • Page 248: Replacement Parts

    PALLET MPCY0010902 PALLET(for H3G Main package_Angle) Blue AMBA00 MANUAL ASSY,OPERATION AMBA0030501 U8110 Manual ASSY for Hutchison in U.K. MMBB00 MANUAL,OPERATION MMBB0113401 U8110 User Manual for Hutchison in UK APEY00 PHONE APEY0070022 U8110 HUKSV Silver ABGA00 BUTTON ASSY,DIAL ABGA0002401 Silver ACGG00...
  • Page 249 Level Location No. Description Part Number Specification Color Remark MFBC00 FILTER,SPEAKER MFBC0007401 MICA00 INSERT,FRONT MICA0001201 LG-G510,511,512 common use, DIA = 1.7mm+2.3t MPBG00 PAD,LCD MPBG0018201 2.2t Silver MPBQ00 PAD,LCD(SUB) MPBQ0013101 Black MTAE00 TAPE,WINDOW(SUB) MTAE0013301 0.2t ACGK00 COVER ASSY,FRONT ACGK0020902 Silver MBJL00...
  • Page 250 TWO-WAY MODE SPEAKER SUVT0002701 SPEAKER for KW-2000 SVLM00 LCD MODULE SVLM0005401 ACGM00 COVER ASSY,REAR ACGM0017802 Silver ACFY00 CONTACT ASSY,ANTENNA ACFY0000501 LG-G510,511,512 common use, MAIN REAR MCJN00 COVER,REAR MCJN0011802 Silver MDAK00 DECO,REAR MDAK0001102 Silver MGAD00 GASKET,SHIELD FORM MGAD0044101 0.2t_LCD Silver Dark...

  • Page 251: Main Component

    11.2 Replacement Parts <Main component> Level Location No. Description Part Number Specification Color Remark SAEY00 PCB ASSY,KEYPAD SAEY0025801 ADCA00 DOME ASSY,METAL ADCA0010901 SAEA00 PCB ASSY,KEYPAD,AUTO SAEA0010301 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP CAP,CERAMIC,CHIP ECCH0000139 470 pF,50V,K,X7R,HD,1005,R/TP CAP,CERAMIC,CHIP ECCH0000182...
  • Page 252 Level Location No. Description Part Number Specification Color Remark LD13 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD14 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD16 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD17 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD18 DIODE,LED,CHIP EDLH0004502 BLUE ,1608 ,R/TP ,0.35T LD19 DIODE,LED,CHIP...
  • Page 253 Level Location No. Description Part Number Specification Color Remark R1149 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R1150 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R1151 RES,CHIP ERHY0000228 270 ohm,1/16W,J,1005,R/TP R1152 RES,CHIP ERHY0000228 270 ohm,1/16W,J,1005,R/TP R1153 RES,CHIP ERHY0000228 270 ohm,1/16W,J,1005,R/TP R1154 RES,CHIP ERHY0000233 470 ohm,1/16W,J,1005,R/TP SPEY00 PCB,KEYPAD SPEY0019202 FR-4 ,.4 mm,DOUBLE ,...
  • Page 254 Level Location No. Description Part Number Specification Color Remark C1110 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1111 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1112 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1113 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP...
  • Page 255 Level Location No. Description Part Number Specification Color Remark C1334 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1335 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1341 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C1352 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C1401 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1402 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP...
  • Page 256 Level Location No. Description Part Number Specification Color Remark C1514 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1601 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C1602 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1622 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C1623 CAP,CERAMIC,CHIP ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP C1624 CAP,CERAMIC,CHIP ECCH0003803 4.7 uF,10V ,Z ,Y5V ,HD ,2012 ,R/TP...
  • Page 257 Level Location No. Description Part Number Specification Color Remark C1810 CAP,CERAMIC,CHIP ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP C1811 CAP,CERAMIC,CHIP ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP C1850 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C1851 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP C1852 CAP,CERAMIC,CHIP ECCH0006501 10 uF,6.3V ,K ,X5R ,TC ,2012 ,R/TP...
  • Page 258 Level Location No. Description Part Number Specification Color Remark C2231 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2232 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2233 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2234 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2235 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2236 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2237 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP...
  • Page 259 Level Location No. Description Part Number Specification Color Remark C2303 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C2304 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2312 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP C2400 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2500 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C2603 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP C2604 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP...
  • Page 260 Level Location No. Description Part Number Specification Color Remark C3204 CAP,CERAMIC,CHIP ECCH0000168 0.1 uF,16V,Z,Y5V,HD,1005,R/TP C3205 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C3212 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C3213 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C3215 CAP,TANTAL,CHIP,MAKER ECTZ0000318 33 uF,10V ,M ,L_ESR ,ETC ,R/TP C3219 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C3220...
  • Page 261 Level Location No. Description Part Number Specification Color Remark 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky D2010 DIODE,SWITCHING EDSY0010401 Barrier Type Diode 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky D2012 DIODE,SWITCHING EDSY0010401 Barrier Type Diode 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky D2013 DIODE,SWITCHING EDSY0010401...
  • Page 262 Level Location No. Description Part Number Specification Color Remark L1502 INDUCTOR,CHIP ELCH0001401 15 nH,J,1005,R/TP L1503 INDUCTOR,CHIP ELCH0001407 5.6 nH,S,1005,R/TP L1504 INDUCTOR,CHIP ELCH0001004 8.2 nH,J,1005,R/TP L1505 INDUCTOR,CHIP ELCH0001001 10 nH,J,1005,R/TP L1507 FILTER,BEAD,CHIP SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA L1601 FILTER,BEAD,CHIP SFBH0002302 120 ohm,1608 ,CHIP BEAD, 2000mA L1602 FILTER,BEAD,CHIP...
  • Page 263 Level Location No. Description Part Number Specification Color Remark N2601 EUSY0196101 BUMP MICRO SMD ,9 PIN,R/TP ,1W AUDIO AMP CSP ,25 PIN,R/TP ,6 CHANNEL ESD FILTER, EMP N2602 EUSY0171201 SOLUTION N2603 EUSY0148801 SOT23-6 ,6 PIN,R/TP ,SPST SWITCH / 2 OHM N3000 EUSY0171301 SOT-23 ,5 PIN,R/TP ,150mA 2.8V LDO...
  • Page 264 Level Location No. Description Part Number Specification Color Remark R1240 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1250 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1301 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1302 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1320 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1321 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R1325 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
  • Page 265 Level Location No. Description Part Number Specification Color Remark R1631 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1632 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1701 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R1702 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R1703 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R1710 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R1711 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
  • Page 266 Level Location No. Description Part Number Specification Color Remark R2210 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2212 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2213 RES,CHIP ERHY0008701 0.22 ohm,1/4W ,J ,2012 ,R/TP R2214 RES,CHIP ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP R2215 RES,CHIP ERHY0008601 0.05 ohm,1/4W ,J ,2012 ,R/TP R2216 RES,CHIP ERHY0008601...
  • Page 267 Level Location No. Description Part Number Specification Color Remark R2618 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2619 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2620 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2621 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R2622 RES,CHIP ERHY0000233 470 ohm,1/16W,J,1005,R/TP R3002 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R3019 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
  • Page 268 Level Location No. Description Part Number Specification Color Remark R3323 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R3325 RES,CHIP ERHY0000220 100 ohm,1/16W,J,1005,R/TP R3327 RES,CHIP ERHY0000160 180K ohm,1/16W,F,1005,R/TP R3328 RES,CHIP ERHY0008603 8.2 Kohm,1/16W ,F ,1005 ,R/TP R3329 RES,CHIP ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP R3330 RES,CHIP ERHY0000250 3.3K ohm,1/16W,J,1005,R/TP R3331 RES,CHIP...
  • Page 269 Level Location No. Description Part Number Specification Color Remark V1770 DIODE,VARIABLE CAP EDVY0001801 SCD80 ,0.09 pF,R/TP , EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , V2201 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , V2203 DIODE,SWITCHING EDSY0011901 IR=30uA(VR=10V) V2300 DIODE,TVS EDTY0007001 SOT23-6 ,9 V, W,R/TP ,TVS DIODE ARRAY V3201 DIODE,TVS...

  • Page 270: Accessory

    BATTERY PACK,LI-ION SBPL0072201 BATTERY PACK SGDY00 DATA CABLE SGDY0005601 DK-40G ,K8000 24PIN I/O + USB A TYPE SGEY00 EAR PHONE/EAR MIKE SET SGEY0003701 U8110 ,Cresyn SSAD00 ADAPTOR,AC-DC SSAD0007835 FREE ,50 Hz,5.2 V,800 mA,CE,CB ,UK(IO.24P) WSYY00 SOFTWARE WSYY0115011 V074I WSYY01 SOFTWARE WSYY0115211 Bundle CD SW Version 1.0...

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