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LG B2070 Service Manual
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LG B2070 Service Manual

LG B2070 Service Manual

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Service Manual
Service Manual
B2000
B2070
Date: October, 2005 / Issue 1.0
P/N : MMBD0047201
Date : March 2005 / Issue 1.0

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Summary of Contents for LG B2070

  • Page 1 Service Manual Service Manual B2000 B2070 Date: October, 2005 / Issue 1.0 P/N : MMBD0047201 Date : March 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents 1. INTRODUCTION......2 5. DOWNLOAD AND CALIBRATION .......91 1.1 Purpose ...........2 1.2 Regulatory Information ....2 5.1 Download ........91 1.3 Abbreviations ........4 5.2 Calibration ........96 2. PERFORMANCE ......6 6. BLOCK DIAGRAM .....99 2.1 H/W Feature ........6 7. CIRCUIT DIAGRAM ....101 2.2 Technical Specification ....8 3.

  • Page 3: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system byan unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.
  • Page 4 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F.

  • Page 5: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge...
  • Page 6 1. INTRODUCTION Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop PSTN Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM...

  • Page 7: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Li-ion, 780 mAh Standard Battery Battery Size: 105.5(W) x 44(H) x 15.8(T) [mm] Battery Weight: TBD Under the minimum current consumption environment Stand by Current (such as paging period 9), the level of standby current is below 4mA.
  • Page 8 2. PERFORMANCE Item Feature Comment Speaker / Receiver One way dual speaker Travel Adapter MIDI 40 Poly (Mono SPK) MP3/AAC Options Data Cable - 7 -...

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification I I tem Description Specification EGSM TX : 890 + (n-1024) × 0.2 MHz RX : 935 + (n-1024) × 0.2 MHz (n=975~1024) Frequency Band TX : 1710 + (n -512) × 0.2 M z RX : 1805 + (n –512) x 0.2 MHz (n=512~885) TX : 1810 + (n-512) ×...
  • Page 10 2. PERFORMANCE Item Description Specification GSM, EGSM Offset from Carrier (kHz). Max. dBc +0.5 –30 –33 –60 –60 600 ~ <1,200 –60 1,200 ~ <1,800 –63 1,800 ~ <3,000 3,000 ~ <6,000 –65 –71 Output RF Spectrum 6,000 (due to modulation) DCS, PCS, Offset from Carrier (kHz).
  • Page 11 2. PERFORMANCE Item Description Specification DCS, PCS Offset from Carrier (kHz). Max. dBm Output RF Spectrum –22 (due to switching transient) –24 1,200 –24 1,800 –27 Spurious Emissions Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @–102 dBm Bit Error Ratio , EGSM BER (Class II) <...
  • Page 12 2. PERFORMANCE Item Description Specification Frequency (Hz) Max. (dB) Min. (dB) –12 – – –7 –5 Receiving Respons 1,000 –5 3,000 –5 3,400 –10 4,000 Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range. 5 dB STMR Stability Margin...
  • Page 13 2. PERFORMANCE Item Description Specification Fast Charge : < 430 mA Charge Current Slow Charge : < 160 mA Antenna Bar Number Power –85 dBm ~ –90 dBm ~ –86 dBm Antenna Display –95 dBm ~ –91 dBm –100 dBm ~ –96 dBm –105 dBm ~ –101 dBm ~ –105 dBm Battery Bar Number...

  • Page 14: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 Transceiver (SI4205-BM, U500) The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltagesupply part, and a VCTCXO part. The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular handsets and wireless data modems.
  • Page 15 3. TECHNICAL BRIEF (1) Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF imagereject filters and the IF SAW filter required in conventional super-heterodyne architectures. A.
  • Page 16 3. TECHNICAL BRIEF Figure 3-2 SI4205 RECEIVER PART B. Intermediate frequency (IF) and Demodulation A quadrature image-reject mixer downconvertsthe RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes.
  • Page 17 3. TECHNICAL BRIEF (2) Transmitter Part The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external poweramplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
  • Page 18 3. TECHNICAL BRIEF B. OPLL The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz.
  • Page 19 3. TECHNICAL BRIEF (3) Frequency Synthesizer Figure 3-4 SI4205 FREQUENCY SYNTHESIZER PART The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.

  • Page 20: Power Amplifier Module

    3. TECHNICAL BRIEF 3.2 Power Amplifier Module (RF3166, U501) The RF3166 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The device is a self-contained 6mmx6mm module with 50Ω input and output terminals. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands.

  • Page 21: 13 Mhz Clock

    3. TECHNICAL BRIEF 3.3 13 MHz Clock (VCTCXO, X500) The 13 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537B), digital base band chipset (U100, AD6527). 2V75_VVCXO X500 R516...
  • Page 22 3. TECHNICAL BRIEF RF2VBS VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Table 3-7 RF LDO CIRCUIT DIAGRAM - 21 -...

  • Page 23: Digital Main Processor

    3. TECHNICAL BRIEF 3.5 Digital Main Processor (AD6527, U100) AD6527/AD6527B GSM-PROCESSOR KEYPADCOL[7:0] Keypad JTAGEN TCK, TMS JTAG Matrix KEYPADROW[7:0] TDI, TDO BACKLIGHT[3.0] Backlight/ JTAG, HSL, GPIO Service Light Universal Servicelight USCTX/RX/CLK System Enhaoced Generic serial port A Connector Generic serial port B (USC) Generic serial port D ROMCS[1:0]...
  • Page 24 3. TECHNICAL BRIEF • AD6527 is an ADI designed processor • AD6527 consists of 1. Control Processor Subsystem • 32-bit ARM7TDMI Control Processor • 58.5 MHz operation at 1.7V • On-board 16KB instruction/Data Cache • 1 Mbitsof on-chip System SRAM 2.
  • Page 25 3. TECHNICAL BRIEF 3.5.1 Interconnection with external devices A. RTC block interface Countered by external X-TAL The X-TAL oscillates 32.768KHz B. LCD module interface The LCD module is controlled by AD6527(U100),DBB. In operating mode, the AD6527(U100) controls the LCD module through _LCD_CS, LCD_DIM_CTRL, LCD_RESET, _WR, 2V8_VMEM, LCD_ID, LCD_BL_EN.
  • Page 26 3. TECHNICAL BRIEF The backlight of LCD module is controlled by DBB via TPS60230RGTR , U400. The control signals related to Backlight LED are given bellow. Signals Description LCD_DIM_CTL Control LCD backlight level in 16 steps (GPO 5) LCD_LED_CTL Control LCD LED LCD_LED_GND LCD_BL_EN It Controls back-light of LCD module.
  • Page 27 3. TECHNICAL BRIEF D. SIM interface The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK, SIM_RST(GPIO_23) are required.
  • Page 28 3. TECHNICAL BRIEF AD6527/AD6527B AD6535 Serial Link Audio Baseband Subsystem and Power Management DSP BUS EBUS PBUS DMA and BUS RBUS IM ARBITRATION SBUS SRAM Peripheral FLASH Subsystem Subsystem ® (ARM7TDMI RF-Control Figure 3-10 AD6527 ARCHITECTURE The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main subsystems connected together through a dynamic and flexible communication bus network.

  • Page 29: Analog Main & Power Management Processor

    3. TECHNICAL BRIEF 3.6 Analog Main & Power Management Processor (AD6537B, U101) AD6525 AD6537B LEDs Light Othello Controllers AD6526 Crystal & Varactor GMSK Filter Filter Tone Filter Headphones or Headset Filter Battery 8 Voltage Regulators Charger VCORE: 1.8 V, 80mA VABB VMEM: 1.8 or 2.8V, 150mA VMIC: 2.5V, 1mA...
  • Page 30 3. TECHNICAL BRIEF • AD6537B is an ADI designed Analog Baseband processor. AD6537B covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. • AD6537B consists of 1. BB Transmit section • GMSK Modulation • I-channel & Q-channel Transmit DACs and Filters •...
  • Page 31 3. TECHNICAL BRIEF 3.6.1 Baseband Transmit Section 1. The AD6537B Baseband Transmit Section is designed to support GMSK for both single-slotand multi-slot application. 2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter. AD6537B BSIFS Active...
  • Page 32 3. TECHNICAL BRIEF 3.6.3 Auxiliary Section 1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers,an Auxiliary ADC, and light controllers. • AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference • IDAC: 10 bits •...
  • Page 33 4. It interconnects with external devices like main microphone, main receiver, and headset. The descriptions of audio port used in B2070 are given bellow in detail. <Up Link> - AIN1P, AIN1N : Main microphone positive/negative terminal...

  • Page 34: Power Management

    3. TECHNICAL BRIEF 3.6.5 Power Management AD6537B CSFS VABB Baseband Analog Control CSDI LDO Regulator Serial CSDO Port Microphone VMIC 2.5V, 1mA LDO Regulator Didital Core 1.8V, 80mA LDO Regulator VCORE VCXO VVCXO 2.75V, 10mA LDO Regulator Memory Interface 1.8 or 2.8V, 150mA LDO Regulator VMEM VEXT...
  • Page 35 3. TECHNICAL BRIEF AD6537B VCORE Enable Digital Core LDO Regulator Mode Enable VMEM Memory Interface THERM Thermal LDO Regulator Mode Shutdown Enable DDLO VEXT External Interface VEXT mode UVLO LDO Regulator Control Bit Mode CHGDET VSIMEn Enable VBAT VSIM SIM Interface Control Bit LDO Regulator KEYON...
  • Page 36 3. TECHNICAL BRIEF 3. Battery Charging Block 1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6537B detects that Charger is inserted, the CC-CV charging starts.
  • Page 37 3. TECHNICAL BRIEF From Headset Microphone To Headset Speaker Figure 3-19 B2000 HEADSET SPEAKER/MIC CIRCUIT (AD6537B) From Main Microphone To Main Receiver Figure 3-20 B2000 MAIN SPEAKER/MIC CIRCUIT (AD6537B) - 36 -...
  • Page 38 3. TECHNICAL BRIEF NORMAL CHARGING Trickle- CHARGING Figure 3-21 CIRCUIT FOR BATTERY CHARGING AT AD6537B In order to reduce time for trickle charging, additional circuit(Pre-charge circuit) was included. This circuit has supplied Max 160mA current into the battery additionally. So call it, it reduce trickle charging time - 37 -...

  • Page 39: Display And Interface

    3. TECHNICAL BRIEF 3.7 Display and Interface Properties Spec. Unit Active Screen Size 28.022(H) X 28.022(V) Color Depth 65,000 colors Resolution 128 X RGB X 128 dots Pixel Size 0.063(H) X 0.209(V) Controlled by _LCD_CS, LCD_RESET, _WR, DATA[00:15], LCD_ID, • _LCD_CS : MAIN LCD driver chip enable.
  • Page 40 3. TECHNICAL BRIEF R401 R400 Figure 3-22 LCD INTERFACE CIRCUIT - 39 -...

  • Page 41: Radio Interface

    3. TECHNICAL BRIEF 3.8 Radio Interface B2070 has a built-in FM Radio.FM Radio Uses Ear Mic as the Antenna. IC for FM Radio is Niigata NS953. B2070 can produce FM Radio Sound Both through Speakerand Ear Mic. 6 1 ( ) 8 0 u 1 .

  • Page 42: Keypad Switches And Scanning

    3. TECHNICAL BRIEF 3.9 Keypad Switches and Scanning The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 21 switches (Normal Key 21EA, No sidekey), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 3-24, except for the power switch, which is connected independently.

  • Page 43: Microphone

    Figure 3-25 Connection between Microphone and AD6537B 3.11 Main Speaker In the case of B2070, The main speaker is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6537B. - 42 -...

  • Page 44: Headset Interface

    3. TECHNICAL BRIEF 3.12 Headset Interface This phone chooses a 5 pin type headset which has 6 electrodes such as HEADSET_SPK_OUT_P, HEADSET_MIC_P, JACK_DETECT, HEADSET_SPK_OUT_N, RADIO_ANT This type supports stereo sound Switching from Receiver to Headset Jack If jack is inserted, JACK_DETECT goes from high to low. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.

  • Page 45: Key Back-Light Illumination

    3. TECHNICAL BRIEF 3.13 Key Back-light Illumination In key back-light illumination, there are 6 Blue LEDs in Main Board, which are driven by MIDI_KEY_BL1 and MIDI_KEY_BL2 signal from ML2871HB. Figure 3-27 KEY BACK-LIGHT ILLUMINTION - 44 -...

  • Page 46: Vibrator

    3. TECHNICAL BRIEF 3.14 VIBRATOR The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is driven from MIDI_VIBRATOR from ML2871HB. Figure 3-28 MOTOR - 45 -...

  • Page 47: Trouble Shooting

    4 . TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RX Trouble TEST POINT Mobile SW TRANCEIVER 13Mhz OSCILLATOR Figure 4-1(a) - 46 -...
  • Page 48 4 . TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check regulator circuit Check VCTCXO Check FEM & Mobile SW Check RX IQ Redownload SW or Do calibration again - 47 -...
  • Page 49 4 . TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT Figure 4-2 CIRCUIT RF2V85 VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Checking Flow Level at Voltage at Change main board Pin3 of U702 Pin5 of U702 Is high? Is 2.8V? Regulator Circuit is OK Replace U702...
  • Page 50 4 . TROUBLE SHOOTING (2) Checking VCTCXO Circuit TEST POINT Checking Flow VCTCXO Circuit is OK 13 MHz O.K? See next Page to check Check Pin 3. ANT SW & Mobile SW Refer to Graph 4-1 (b) 2.7V OK? Changing X500 Check Pin 4.
  • Page 51 4 . TROUBLE SHOOTING (3) Checking FEM & Mobile SW TEST POINT CIRCUIT Figure 4-5 Waveform FEM Control GSM & DCS Graph 4-3(a) FEM Control PCS Graph 4-3(b) - 50 -...
  • Page 52 4 . TROUBLE SHOOTING Checking Flow For these 2 No Call connection is needed Check SW501 Pin ANT,RF Changing SW500 Open with RF Cable connected . Check SW500 Pin ANT,RF Changing SW500 Short with No RF Cable Connected Check R512, R515, R517 VC1 :Low or HIGH Check whether FEM Changing the board...
  • Page 53 4 . TROUBLE SHOOTING (4) Checking RX IQ TEST POINT CIRCUIT Waveform Graph 4-4 Checking Flow Che ck C514, C516. Similar? Replace U500 Check if there is Any Major Difference Refer to Graph 4-4 Redownload software and calibration againg - 52 -...

  • Page 54: Tx Trouble

    4 . TROUBLE SHOOTING 4.2 TX Trouble TEST POINT Mobile SW TRANCEIVER 13Mhz OSCILLATOR - 53 -...
  • Page 55 4 . TROUBLE SHOOTING Checking Flow START HP8960 : Test mode 62 CH, 7 level setting (TCH) 62CH, -60dBm setting (BCCH) Spectrum analyzer setting Oscilloscope setting Check regulator circuit Check VCTCXO Check FEM & Mobile SW Check PAM contral signal Check TX IQ Redownload SW or...
  • Page 56 4 . TROUBLE SHOOTING (1) Checking Regulator Circuit TEST POINT CIRCUIT RF2V85 VBAT U702 MIC5255-85BM5 CLKON C533 C734 C534 0.01u (1608) Checking Flow Level at Voltage at Change main board Pin3 of U702 Pin5 of U702 Is high? Is 2.8V? Replace U702 Regulator Circuit is OK See next Page to check...
  • Page 57 4 . TROUBLE SHOOTING (2) Checking VCTCXO Circuit Checking Flow TEST POINT VCTCXO Circuit is OK 13 MHz O.K? See next Page to check Check Pin 3. ANT SW & Mobile SW Refer to Graph 4-1 (b) 2.7V OK? Changing X500 Check Pin 4.
  • Page 58 4 . TROUBLE SHOOTING (3) Checking Ant SW & Mobile SW TEST POINT CIRCUIT Waveform Figure 4-5 VC1 LOW VC2 LOW VC3 HIGH FEM Control EGSM Graph 4-6(a) VC1 LOW VC2 HIGH VC3 LOW FEM Control DCS & PCS Graph 4-6(b) - 57 -...
  • Page 59 4 . TROUBLE SHOOTING Checking Flow For the test, TX Stand alone Mode is needed. Refer to chapter 11 (PL=7 for GSM, PL=2 for DCS) Check R512, R515, R517 Check whether FEM Check VC1, VC2, VC3 Changing board Set as TX mode Refer to Graph4-6(a), 4-6(b) Refer to Table 4-3 Pin17 : ~29.5dBm...
  • Page 60 4 . TROUBLE SHOOTING (4) Checking PAM Control Signal TEST POINT CIRCUIT Waveform TX_RAMP Band Select (R501) GSM TX_Low DCS/PCS TX_High PAM_EN Graph 4-7 Checking Flow Check TX_RAMP and PA_EN Similar? Download S/W Check if there is Any Major Difference or not Refer to Graph 4-7 Go to Next Step - 59 -...
  • Page 61 4 . TROUBLE SHOOTING (6) Checking TX IQ Waveform TEST POINT Graph 4-8 CIRCUIT Checking Flow Check if there is Similar? Replace U500 Any Major Difference Refer to Graph 4-8 Redownload the Software And calibrate - 60 -...

  • Page 62: Power On Trouble

    4 . TROUBLE SHOOTING 4.3 Power On Trouble TEST POINT CIRCUIT - 61 -...
  • Page 63 4 . TROUBLE SHOOTING Checking Flow START Check Battery Voltage Charge or Change Battery > 3.35V ? Push power-on key Check the contact of power key And check the level change Or dome-switch of PWRKEY Check the voltage of Replace U101 The LDO outputs at U101 VCORE=1.8V WCXO=2.75V...

  • Page 64: Charging Trouble

    4 . TROUBLE SHOOTING 4.4 Charging Trouble TEST POINT R108 Q100 D100 CIRCUIT - 63 -...
  • Page 65 4 . TROUBLE SHOOTING Checking Flow Resolder the CN300 I/O Connector (CN300) Pin 4,5 : VCHARGE is well-solderd? Pin 12,26.30 : GND The TA is out of order Voltage at anode of Change the TA D100 = 5.2 V? Resoler the Q100, D100, R108 Q100, D100, R108 are well-soldered?

  • Page 66: Vibrator Trouble

    4 . TROUBLE SHOOTING 4.5 Vibrator Trouble TEST POINT CIRCUIT . 2 - - 65 -...
  • Page 67 4 . TROUBLE SHOOTING Checking Flow SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu START Is the voltage at pin 3 Check the soldering of U401 high? of R315, R399 Resolder R315, R399 Is the voltage at pin 1 Check the soldering of U401 high?

  • Page 68: Lcd Trouble

    4 . TROUBLE SHOOTING 4.6 LCD Trouble TEST POINT - 67 -...
  • Page 69 4 . TROUBLE SHOOTING Checking Flow START Check the soldering of Resoldering CN400 CN400 ? Is the connection of Reassemble FPCB with CN400 connector FPCB with connector on PCB(CN400) ok ? Check the soldering of Resoldering EMI filter (FL400~FL403) EMI filter ? Does LCD work Replace LCD module properly ?

  • Page 70: Radio Trouble

    4 . TROUBLE SHOOTING 4.7 Radio Trouble TEST POINT U U 7 7 0 0 0 0 X X 2 2 0 0 0 0 U U 7 7 0 0 1 1 CIRCUIT - 69 -...
  • Page 71 4 . TROUBLE SHOOTING Checking Flow START Insert Earmic to earjack Level of Resolder R421 RADIO_DETECT Is high? Earphone will work Set the audio part of the test properly Equipment to echo mode Check Level Can you hear your Level 1,2,8,9 pin U205 works 2,8,1,9 pin of U701 voice from the...

  • Page 72: Speaker Trouble

    4 . TROUBLE SHOOTING 4.8 Speaker Trouble TEST POINT - 71 -...

  • Page 73: Circuit Diagram

    4 . TROUBLE SHOOTING CIRCUIT DIAGRAM - 72 -...
  • Page 74 4 . TROUBLE SHOOTING Checking Flow START Check the state of Reassemble speaker contact of dual mode speaker Check Re-solder U202 U202 works properly Check Re-solder U206 U206 works properly Check Voltage level of Re-solder the components 4,5 pin of U206 Replace U203 Speaker Change main board...

  • Page 75: Sim Card Interface Trouble

    4 . TROUBLE SHOOTING 4.9 SIM Card Interface Trouble TEST POINT CIRCUIT DIAGRAM - 74 -...
  • Page 76 4 . TROUBLE SHOOTING Checking Flow START Change the SIM Card. Our Phone Does the SIM cards supports only 3V SIM card supports 3V? Voltage Replace J300 or check Voltage at pin1 of at VSIM of U101 soldering of components J300 is 3V? Is 3V? Change the SIM Card...

  • Page 77: Earphone Trouble

    4 . TROUBLE SHOOTING 4.10 Earphone Trouble TEST POINT J200 U205 U200 U201 CIRCUIT DIAGRAM - 76 -...
  • Page 78 4 . TROUBLE SHOOTING Checking Flow START Resolder J200 Does the audio Level at profile of the phone Resolder R123, R216 JACK_DETECT signal change to the or Replace J200 is low earphone mode? Set the audio part of the test Equipment Change the earphone to echo mode and try again...

  • Page 79: Key Backlight Trouble

    4 . TROUBLE SHOOTING 4.11 KEY backlight Trouble TEST POINT - 78 -...
  • Page 80 4 . TROUBLE SHOOTING CIRCUIT DIAGRAM Checking Flow START Is the voltage level VBAT Charge battery 3.6~4.2V? Are all LEDs Check the soldering Working? each R and LED Replace or resoldering Backlight will work properly component - 79 -...

  • Page 81: Receiver Trouble

    4 . TROUBLE SHOOTING 4.12 Receiver Trouble TEST POINT CIRCUIT DIAGRAM - 80 -...
  • Page 82 4 . TROUBLE SHOOTING Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max. START Check the state of Reassemble receiver contact of dual mode speaker (receiver) U202 works...

  • Page 83: Microphone Trouble

    4 . TROUBLE SHOOTING 4.13 Microphone Trouble TEST POINT CIRCUIT DIAGRAM - 82 -...
  • Page 84 4 . TROUBLE SHOOTING Checking Flow SETTING : After intialize Agilent 8960, Test EGSM, DCS mode START Voltage across R200 Voltage VMIC of U101 Replace U101 = DC 2.5V? = DC 2.5V? Resolder R200 & R203 Check the signal Replace microphone Level at each side of MIC200 mV AC?

  • Page 85: Rtc Trouble

    4 . TROUBLE SHOOTING 4.14 RTC Trouble TEST POINT CIRCUIT DIAGRAM - 84 -...
  • Page 86 4 . TROUBLE SHOOTING Checking Flow START Is the voltage Charge or change BAT100 level of BAT100 > 1.2V? Check Soldering of Resolder R104. C112, C149 R104, C112, C149 Check the voltage at Resolder R110, C130 or 1,4 of X100 Replace X100 Change main board - 85 -...

  • Page 87: Indication Led Trouble

    4 . TROUBLE SHOOTING 4.15 Indication LED Trouble TEST POINT Q301 Q401 CIRCUIT DIAGRAM - 86 -...
  • Page 88 4 . TROUBLE SHOOTING Checking Flow Indication LED only operates in trickle charging mode. START Voltage level Voltage level at 3pin of Q401 at 2pin of Q401 Is about 40mV Is about 680mV Resolder Q401 Resolder Q301 Voltage level Check soldering of Resolder R350 at 2pin of Q301 R350...

  • Page 89: Ptt Trouble

    4. TROUBLE SHOOTING 4.16 PTT Trouble CIRCUIT DIAGRAM 2V8_VEXT C223 U204 0.1u NLAST4599DFT2 R226 RADIO_SPK_R 5 COM R228 NC 4 REC_P SPK_RADIO_SEL Checking Flow START Connection Reconnect FPCB to CN601 between FPCB and CN601 is OK? SPKP_LDO_EN signal is AMP_SD signal High? is Low? Soldering between...

  • Page 90: Speakerphone Trouble

    4. TROUBLE SHOOTING 4.17 Speakerphone Trouble TEST POINT R228 CIRCUIT DIAGRAM NC_R6 CHRDACREF IBIAS REFPWR CRST CHGOSC VBAT AD6537B AD6535 1.2M 0.1uF 0.01uF C110 C111 C109 2012 VCORE1 VCORE2 VMEM1 VMEM2 2V8_VEXT C223 U204 0.1u NLAST4599DFT2 R226 RADIO_SPK_R 5 COM R228 NC 4 REC_P...
  • Page 91 4. TROUBLE SHOOTING Checking Flow SETTING: Connect PIF to the phone, and Power on. Call and enter speakerphone mode START Not OK Check R228 = 1.2V Replace it Check the soldering of 1 point GO to Speaker Trouble - 90 -...

  • Page 92: Download And Calibration

    5. DOWNLOAD AND CALIBRATION 5. DOWNLOAD AND CALIBRATION 5.1 Download A. Download Setup Figure 5-1 describes Download setup UART Figure 5-1 DOWNLOAD SETUP - 91 -...
  • Page 93 5. DOWNLOAD AND CALIBRATION B. Download Procedure 1. Access Flash loader program in PC and select Erase(Don’t check OWUD). 1. Select 2. Select Port Rate 3. Select Hermes 4. Select Erase 5. Insert FDI region . Don’t Check OWUD 2. Press Start and Wait until Erase is completed. 2.
  • Page 94 5. DOWNLOAD AND CALIBRATION 3. Press Write to start Download and press key to choose software (AlchemyDate.mot) 1. Select Port 2. Check 3. Check - 93 -...
  • Page 95 5. DOWNLOAD AND CALIBRATION 4. Choose software 4. Choose software 1. Select File 2. Press Open 5. Wait until coverting from MOT to BIF is completed (Don’t check OWUD) 5. Wait until coverting from MOT to BIF is completed (Donʼt check OWUD) 3.
  • Page 96 5. DOWNLOAD AND CALIBRATION 6. Press Start and Pover on the phone using JIG remote Power on (Switch 1) - 95 -...

  • Page 97: Calibration

    5. DOWNLOAD AND CALIBRATION A. Equipment List Equipment for Calibration Type/Model Brand Wireless Communication Test Set HP-8960 Agilent RS-232 Cable and Test JIG RF Cable Power Supply HP-66311B Agilent GPIO interface card HP-GPIB Agilent Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium II class above 300MHz Table 5-1 CALIBRATION EQUIPMENT LIST...
  • Page 98 5. DOWNLOAD AND CALIBRATION Figure 5-3 THE TOP VIEW OF TEST JIG C. Test Jig Operation Power Source Description Power Supply Usually 4.0V Travel Adaptor Use TA, name is TA-20G(24pin) Table 5-2 JIG POWER Switch Number Name Description Switch 1 ADI-REMOTE In ON state, phone is awaked.
  • Page 99 5. DOWNLOAD AND CALIBRATION 1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3 of DIP SW ON state always 4.

  • Page 100: Block Diagram

    6. BLOCK DIAGRAM 6. BLOCK DIAGRAM - Base Band SIM_RST/ CLK/DATA VSIM USC(0:5) DEBUG BAT_TEMP VBAT VCHG VCHG - 99 -...
  • Page 101 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM - RF - 100 -...

  • Page 102: Circuit Diagram

    USB BOOT INT CLOCK KEY_COL2 KEYPADCOL2 USC4 USC4 NAME 2005 USB BOOT EXT CLOCK KEY_COL3 KEYPADCOL3 USC5 USC5 Approved KIM B.Y. KEY_COL4 KEYPADCOL4 USC6 USC6 03.20 DRAWING Iss. Notice No. Date Name Ver.1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 101 -...
  • Page 103 Sign & Name C236 Sheet/Sheets MODEL B2070 2005 Designer KIM H.J. 03.20 2005 Checked LEE S.Y. DRAWING 03.20 AUDIO/MIDI NAME 2005 Approved KIM B.Y. 03.20 DRAWING Iss. Notice No. Date Name Ver.1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 102 -...
  • Page 104 VSS5 _OE2 MEMORY, MMI, I/O C327 C328 C329 C330 VSS6 _RST NAME 0.1u VSS7 WAIT _WAIT 2005 Approved KIM B.Y. VSS8 BURSTCLK 03.20 DRAWING Iss. Notice No. Date Name Ver.1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 103 -...
  • Page 105 Checked 03.20 MC-146_7pF DRAWING C726 C727 X200 LCD CONN,RADIO NAME 2005 C728 KIM B.Y. R709 R710 Approved 03.20 4.7K 4.7K RADIO_SDA DRAWING RADIO_SCL Iss. Notice No. Date Name LG Electronics Inc. Ver.1.1 RADIO_STO LGIC(42)-A-5505-10:01 LG Electronics Inc. - 104 -...
  • Page 106 B2070 MODEL 2005 Designer KIM Y.G. 03.20 EGSM_TX DCS/PCS_TX 2005 Checked LEE S.Y. 03.20 DRAWING EGSM/DCS_RX NAME 2005 KIM B.Y. PCS_Rx Approved 03.20 DRAWING Iss. Notice No. Date Name Ver.1.1 LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 105 -...

  • Page 107: Pcb Layout

    8. PCB LAYOUT - 106 -...
  • Page 108 8. PCB LAYOUT - 107 -...
  • Page 109 - 108 -...

  • Page 110: Engineering Mode

    9. ENGINEERING MODE 9. ENGINEERING MODE A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to non-engineering mode operation.

  • Page 111: Bb Test [Menu 1]

    9. ENGINEERING MODE 9.1 BB Test [MENU 1] 9.1.1 FM Radio 1) Listen Radio : This menu is to used for listening FM Radio.(It must be connected Earphone.) 2) Test ON 3) Test OFF 9.1.2 LCD 1) Contrast value : This menu is to input Contrast Value of the LCD. 2) Test ON 3) Test OFF 9.1.3 Backlight...

  • Page 112: Rf Test [Menu 2]

    9. ENGINEERING MODE 9.1.7 BATTERY 1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT, SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT 2) TEMP Cal : This displays the value of Temperature Calibration. The following menus are displayed in order : TEMP_HIGH_LIMIT, TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT 9.1.8 Audio...

  • Page 113: Mf Mode [Menu 3]

    9. ENGINEERING MODE 9.3 MF mode [MENU 3] This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test. 9.3.1 All auto test LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker, 9.3.2 Backlight LCD Backlight is on for about 1.5 seconds at the same time, thenoff.

  • Page 114: Trace Option [Menu 4]

    9. ENGINEERING MODE 9.4 Trace option [MENU 4] This is NOT a necessary menu to be used by neither engineers nor users. 9.5 Call timer [MENU 5] This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) All calls : This displays total conversation time.

  • Page 115: Stand Alone Test

    10. STAND ALONE TEST 10. STAND ALONE TEST 10.1 Introduction This manual explains how to examine the status of RX and TX of the model. A. Tx Test TX test - this is to see if the transmitter of the phones is activating normally. B.

  • Page 116: Means Of Test

    10. STAND ALONE TEST 10.3 Means of Test a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button Figure 10-1.
  • Page 117 10. STAND ALONE TEST Figure 10-2. HW test setting Figure 10-3. Ramping profile - 116 -...

  • Page 118: Auto Calibration

    11. AUTO CALIBRATION 11. AUTO CALIBRATION 11.1 Overview Autocal(Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
  • Page 119 11. AUTO CALIBRATION Figure 11-1 Auto Calibration Program Screen ➝ Cable loss : Enter the RF cable loss GSM and DCS Screen ➝ GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address Screen ➝ ADC Channel : Default ADC Calibration Channel Screen ➝...

  • Page 120: Agc

    11. AUTO CALIBRATION 11.4 AGC This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
  • Page 121 - 120 -...

  • Page 122: Exploded View

    12. EXPLODED VIEW && REPLACEMENT PART LIST 12.1 Exploded View - 121 -...
  • Page 123 - 122 -...

  • Page 124: Exploded View & Replacement Part List

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> Location Level Description Part Number Specification Color Remark GSM,BAR/FILP TGSM0039409 Black AAAY00 ADDITION AAAY0128019 Black...
  • Page 125 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark MGAD00 GASKET,SHIELD FORM MGAD0079301 Gold MTAC00 TAPE,SHIELD MTAC0021401 Gold MTAC01 TAPE,SHIELD MTAC0021302 3X6X0.28t-meterial-EMI TAPE Gold MTAC02 TAPE,SHIELD MTAC0021402 30X25X0.28t-material-EMI TAPE Gold Without MTAZ00 TAPE MTAZ0060101 Color Without MLAB00...

  • Page 126: Main Component

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> Location Level Description Part Number Specification Color Remark SUSY SPEAKER SUSY0014801 PIN ,8 ohm,88 dB,20 mm,*14mm SJMY00 VIBRATOR,MOTOR SJMY0007001...
  • Page 127 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C120 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C121 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP C122 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C123 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C124 CAP,CERAMIC,CHIP ECCH0000143...
  • Page 128 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C223 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C224 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C225 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C226 CAP,CERAMIC,CHIP ECCH0000159 22 nF,16V,K,X7R,HD,1005,R/TP C227 CAP,TANTAL,CHIP,MAKER ECTZ0005201...
  • Page 129 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP C350 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C401 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP C402 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP C403 CAP,CERAMIC,CHIP ECCH0000393...
  • Page 130 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C534 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C535 CAP,CERAMIC,CHIP ECCH0000135 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP C536 CAP,CERAMIC,CHIP ECCH0005801 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP C537 CAP,CERAMIC,CHIP ECCH0000135...
  • Page 131 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark C724 CAP,CERAMIC,CHIP ECCH0000279 0.47 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP C725 CAP,CERAMIC,CHIP ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP C726 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C727 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP C728 CAP,CERAMIC,CHIP ECCH0004904...
  • Page 132 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark L700 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP L701 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP L702 INDUCTOR,CHIP ELCH0009105 18 nH,J ,1005 ,R/TP ,COIL L703 INDUCTOR,CHIP ELCH0009105 18 nH,J ,1005 ,R/TP ,COIL 2.9*1.9*0.8(t) ,.7 W,20 V,-6 A,R/TP ,NDC652P Q100 TR,FET,P-CHANNEL...
  • Page 133 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R217 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R218 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R219 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R220 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R221 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R222 RES,CHIP ERHY0000203...
  • Page 134 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R326 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R327 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R329 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R330 RES,CHIP ERHY0000237 680 ohm,1/16W,J,1005,R/TP R331 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R334 RES,CHIP ERHY0000241...
  • Page 135 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R505 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R506 RES,CHIP ERHY0000210 30 ohm,1/16W,J,1005,R/TP R507 RES,CHIP ERHY0000224 180 ohm,1/16W,J,1005,R/TP R508 RES,CHIP ERHY0000224 180 ohm,1/16W,J,1005,R/TP R512 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R514 RES,CHIP ERHY0000220...
  • Page 136 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark LLP ,10 PIN,R/TP ,1 Watt Audio Power Amplifier / Leadless U206 EUSY0149701 Type U300 EUSY0250201 BGA ,88 PIN,R/TP ,128T+32ps(MLC) 8X10 U400 EUSY0238201 QFN ,16 PIN,R/TP ,3 LEDs, WHITE LED CHARGE PUMP SOT23 ,5 PIN,R/TP ,2.85V/150mA Low Noise uCap LDO U401 EUSY0118602...
  • Page 137 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark 13 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.2 ,SV 2.85V, AFC X500 VCTCXO EXSK0006501 0.8V SAFD PCB ASSY,MAIN,SMT TOP SAFD0046002 C201 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP C202 CAP,TANTAL,CHIP,MAKER ECTZ0005201 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP C209 CAP,CERAMIC,CHIP...
  • Page 138 12. EXPLODED VIEW & REPLACEMENT PART LIST Location Level Description Part Number Specification Color Remark R344 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R345 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R346 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R347 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R348 RES,CHIP ERHY0000213 47 ohm,1/16W,J,1005,R/TP R349 RES,CHIP ERHY0000213...

  • Page 139: Accessory

    12. EXPLODED VIEW & REPLACEMENT PART LIST 12.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Location Level Description Part Number Specification Color Remark MHBY00 HANDSTRAP MHBY0002101 T5100 RUSSV Square Coupling, Cow Leather Metal Silver 3.7 V,830 mAh,1 CELL,PRISMATIC ,FG101 Without...

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