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2 PREVENTION OF ELECTROSTATIC
DISCHARGE (ESD) TO
ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
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Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits, some field-effect transistorsand semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused
by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped
assembly, drain off any ESD on your body by touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging ESD wrist strap,which should remove
electrostatic charge for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a
conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure
of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an antistatic solder removal device. Some solder removal devices not classified as
"antistatic (ESD protected)" can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to
damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before
you are ready to install it. (Most replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement ES
device, touch the protective material to the chassis or circuit assembly into which the device
will be installed.
CAUTION:Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
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