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Notes
■ Mounting
Use the land of the printed-circuit board on which the sensor is securely fixed.
■ Soldering
Avoid the external thermal influence as the product has a limited thermal capacity due to its compact structure.
Heat deformation may damage the sensor or deteriorate its performance. Use the non-corrosive rosin flux. Prevent
the flux from entering into the inside of the product as the sensor is exposed to the atmosphere.
1) Manual soldering
• Raise the temperature of the soldering tip between 260 and 300 °C
within 5 seconds.
• The sensor output may vary if the load is applied on the terminal during soldering.
• Keep the soldering tip clean.
2) DIP soldering (DIP Terminal)
• Keep the temperature of the DIP solder tank below 260 °C
• To avoid heat deformation, do not perform DIP soldering when mounting on the circuit board which has a
small thermal capacity.
3) Reflow soldering (SMD Terminal)
• The recommended reflow temperature profile conditions are given below.
• We recommend the screen solder printing method as the method of cream.
• Please refer to the recommended PC board specification diagram for the PC board foot pattern.
• Self alignment may not always work as expected, therefore, please carefully the position of the terminals
and pattern.
• The temperature of the profile is assumed to be a value measured with the printed wiring board of the
terminal neighborhood.
• Please evaluate solderbility under the actual mounting conditions since welding and deformation of the
pressure inlet port may occur due to heat stress depending on equipments or conditions.
4) Rework soldering
• Complete rework at a time.
• Use a flattened soldering tip when performing rework on the solder bridge. Do not add the flux.
• Keep the soldering tip below the temperature described in the specifications.
5) Avoid drop and rough handling as excessive force may deform the terminal and damage soldering
characteristics.
6) Keep the circuit board warpage within 0.05 mm of the full width of the sensor.
7) After soldering, do not apply stress on the soldered part when cutting or bending the circuit board.
8) Prevent human hands or metal pieces from contacting with the sensor terminal. Such contact may cause
anomalous outlets as the terminal is exposed to the atmosphere.
9) After soldering, prevent chemical agents from adhering to the sensor when applying coating to avoid
insulation deterioration of the circuit board.
10) Please consult us concerning leadfree soldering.
■ Wire connection
1) Correctly wire as in the connection diagram. Reverse connection may damage the product and degrade the
performance.
2) Do not use idle terminals to prevent damages to the sensor.
■ Cleaning
• Prevent cleaning liquid from entering the inside of the product as the sensor is exposed to the atmosphere.
• Do not perform ultrasonic cleaning in order to prevent damages to the product.
■ Environment
1) Avoid use and storage in the corrosive gas (organic solvent, sulfurous acid and hydrogen sulfide gases) which
negatively affects the product.
2) Install the capacitor on the power supply terminal of the sensor and stabilize supply voltage to maintain a
superimposed noise resistance. Recommended installation is to arrange 0.1 μF and 1,000 pF in parallel. Before
use, check the noise resistance and select/add the optimal capacitor.
3) Use surge absorbers as applying the external surge voltage may damage the internal circuit.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Pressure Sensor/PS-A (ADP5)
Main heating
230 °C
446 °F
Preheating
150 °C
302 °F
With in
10 sec.
With in 60 sec.
500 and 572 °F
572 °F
and solder within 5 seconds.
Time
(30 W) and solder
01
Feb. 2019
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