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Product End-of-Life Disassembly Instructions
Product Category: Data Storage Devices
Marketing Name / Model
[List multiple models if applicable.]
DAT160m (array module) / Q1575X. Where X = any alphanumeric combination
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
EL-MF877-00
Template Revision A
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Quantity
of items
included
in product
5
0
0
0
0
0
0
0
0
0
0
0
0
0
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Summary of Contents for HP Invent Q1575 Series
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Tool Description Tool Size (if applicable) Crosshead screwdriver Torx screwdriver T-10 Nippers 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 3.1.1. Remove the array cradle from the mechanism. Secured with 4 x T-10 screws – 2 x on either side. Remove the 1 x SCSI I/O PCA >...
- Page 3 Remove 14 screws per side. Remove M1.7 screw a rear side. Remove 2 x M1.7 screws at front top. BASE CARTRIDGE- BOM-ASSY HOUSING Remove base and cartridge housing Remove 1 x CH screw from BOM Unlock and release FFCs and FPCs ASSY from the PCA.
- Page 4 PWA-MODE-B-ASSY DRUM-ASSY REEL-MOTOR-ASSY Remove PWA-MODE-B-ASSY > 10 square cm’s EL-MF877-00 Page 4 Template Revision A...