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Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Classmate Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
PCBA, IO Board, RAM, HDD, TOUCHPAD
All types including standard alkaline and lithium coin
or button style batteries Li-ion polymer
Battery,lithium coin batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps LCD
Adapter Cable, Power Core
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
5
2
1
2
Page 1
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Summary of Contents for HP Classmate
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 Dis-fastn TOP Screw*6 Dis-fasten the Base Screws*8 and Open Base Case with Top Cover EL-MF877-00 Page 3 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 4 Remove The Battery's Black Tape and Dis-fasten Battery's Screws *2 Remove the Battery EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 5 7. Dis-fasten the HDD’s Screws *4, Pull Out HDD’s FPC Cable and Remove HDD. 8. Dis-fasten The HDD Bracket Screw*4 EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 6 9. Remove the HDD Bracket 10. Remove the HDD Rubber and FPC Cable EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 7 11. Remove the DDR’s Acetate Tape and the HDD 12. Remove the Wlan Card’s Acetate Tape and Dis-fasten the Wlan Card’s Screw *1 EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 8 13. Pull Out the WLan Cable and Remove the WLan Card 14. Separate WLan Cable EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 9 15. Dis-Fasten the Thermal Model’s Screws*3 16. Remove the Thermal Model. EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 10 17. Dis-fasten the LVDS Cable’s Screws*1 and Pull out the LVDS Cable. 18. Pull out the MIC cable EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 11 19. Remove the DC-in Sponge. 20. Pull out the DC-in cable, Dis-fasten the DC-in Screws*1 and Remove the Dc-in Cable EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 12 21. Pull out the Speaker Cable 22. Dis-fasten the Speaker’s Screwa*4 EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 13 23. Remove the Speaker Cable 24. Pull out the IO Board FFC*2 and Touch Pad FFC*1. EL-MF877-00 Page 13 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 14 25. Dis-fasten the MotherBoard Screws*2 and the IO Board Screws*1 26. Remove the MotherBoard and the IO Board. EL-MF877-00 Page 14 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 15 27. Remove the IO Board FFC Cable* 2 28. Remove the DDR Mylar on the MotherBoard. EL-MF877-00 Page 15 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 16 29. Remove the Touch Pad FFC on the MotherBoard 30. Remove the Acetate Tape and the MB’s Al Foil EL-MF877-00 Page 16 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 17 31. Remove the CMOS Battery 32. Dis-fasten the LCD Hinge-R screws*1 EL-MF877-00 Page 17 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 18 33. Remove Hinge Cover 34. Dis-fasten LCD Hinge screw*2 EL-MF877-00 Page 18 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 19 35. Separate LCD Module with Base units 36. Dis-fasten the Palmrest screw *6 EL-MF877-00 Page 19 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 20 37. Remove the Palmrest 38. Remove LCD Rubber and Dis-fasten the Screw*8 EL-MF877-00 Page 20 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 21 39. Remove the LCD Back Cover. 40. Dis-fasten the LCD Hinge Screw*4 and Remove the Hinge EL-MF877-00 Page 21 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 22 41. Dis the CCD Hinge Screw*2 42. Pull out the LVDS Cable and Remove the CCD Model. EL-MF877-00 Page 22 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 23 43. Remove the LCD Hinge Al Foil*2 and the CCD Hinge Al Foil*1 44. Remove the WLan Main Cable and WLan Aux Cable EL-MF877-00 Page 23 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 24 45. Dis-fasten the LCM Screw*4 46. Remove the LCM Part EL-MF877-00 Page 24 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 25 47. Dis-fasten the LCD Bracket Screw*4 48. Separate the LCM and the LCD Bracket. EL-MF877-00 Page 25 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 26 49. Take off the CCD Liens*2 50. Dis-fasten the CCD Screw*2 and Separation the CCD Part EL-MF877-00 Page 26 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 27 51. Remove the CCD Hinge 52. Remove the MIC Cable and CCD Model. EL-MF877-00 Page 27 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 28 53. Remove the CCD Lens*1 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF877-00 Page 28 Template Revision B PSG instructions for this template are available at EL-MF877-01...