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Product End-of-Life Disassembly Instructions
Product Category: Desktop PC
Marketing Name / Model
[List multiple models if applicable.]
HP Z VR Backpack G1 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
MB/dock borad
All types including standard alkaline and lithium coin
or button style batteries Main battery/RTC
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
POWER CORD/ dock cable
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
2
2
0
2
Page 1
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Summary of Contents for HP Z VR Backpack G1
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
- Page 3 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). 1. Remove screw rubber foot and screw *6 pcs 2.
- Page 4 4. Remove battery cable and DC-in cable from MB connector EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 5 Remove External battery cable. Remove DC-in cable. 5. Remove CPU Fan ,connector and screw *3 6. Remove GPU Fan ,connector and screw *3 EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 6 7. Remove Thermal module and screw *8 8. Remove antenna support L lower and screw *2 EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 7 9. Remove Main and Aux 10. Remove Waln card and screw *1 EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 8 11. Remove lower holder BKT and screw *2 12. Remove internal battery and screw *3 / Remove RTC battery Battery location: Backpack inside on the bottom position. EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 9 EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 10 RTC battery location/ Remove RTC 2032 battery on the motherboard: 13. Remove external battery BKT L / R and screw *4 EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 11 14. Remove DC-in BKT and screw *1 15. Remove DC-in cable 16. Remove Antenna support R upper and screw *1 EL-MF877-00 Page 11 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 12 17. Remove Antenna support L upper and screw *1 18. Remove Absorber on top IO holder BKT EL-MF877-00 Page 12 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 13 19. Remove top IO holder BKT and screw *2 20. Remove sheilding can 21. Remove fan screw nut *2 EL-MF877-00 Page 13 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 14 22. Remove power board and screw *2 23. Remove VR DC-out cable EL-MF877-00 Page 14 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 15 24. Remove MB and screw *2 25. Remove power button BLM 26. Remove MB EL-MF877-00 Page 15 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 16 27. Remove VR DC-out BKT and screw *2 28. Remove screw rubber foot and screw *6 pcs EL-MF877-00 Page 16 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 17 29. Remove bottom door from the Dock cover 30. Remove left / right cover from the Dock cover EL-MF877-00 Page 17 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 18 31. Remove Dock cover from Dock inside 32. Remove DC cable*2 EL-MF877-00 Page 18 Template Revision B PSG instructions for this template are available at EL-MF877-01...
- Page 19 33. Remove Docking MB and screw *6. EL-MF877-00 Page 19 Template Revision B PSG instructions for this template are available at EL-MF877-01...