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<Dual-In-Line Package Intelligent Power Module>
1200V Mini DIPIPM with BSD Series APPLICATION NOTE
PSS**S72FT
CHAPTER 1 INTRODUCTION .................................................................................................................................2
1.1 Features of 1200V Mini DIPIPM with BSD ............................................................................................................. 2
1.2 Functions ............................................................................................................................................................... 3
1.3 Target Applications ................................................................................................................................................. 4
1.4 Product Line-up ...................................................................................................................................................... 4
CHAPTER 2 SPECIFICATIONS AND CHARACTERISTICS ....................................................................................5
2.1 1200V Mini DIPIPM with BSD Specifications ......................................................................................................... 5
2.1.1 Maximum Ratings .............................................................................................................................................................................................. 5
2.1.2 Thermal Resistance ........................................................................................................................................................................................... 7
2.1.3 Electric Characteristics and Recommended Conditions ..................................................................................................................................... 8
2.1.4 Mechanical Characteristics and Ratings .......................................................................................................................................................... 10
2.2 Protective Functions and Operating Sequence ..................................................................................................... 11
2.2.1 Short Circuit Protection .................................................................................................................................................................................... 11
2.2.2 Control Supply UV Protection .......................................................................................................................................................................... 13
2.3 Package Outlines ................................................................................................................................................. 20
2.3.1 Package outlines.............................................................................................................................................................................................. 20
2.3.2 Marking ............................................................................................................................................................................................................ 21
The Lot number indicates production year, month, running number and country of origin. ........................................................................................ 21
2.3.3 Terminal Description ........................................................................................................................................................................................ 22
2.4 Mounting Method ................................................................................................................................................. 24
2.4.1 Electric Spacing ............................................................................................................................................................................................... 24
2.4.2 Mounting Method and Precautions ................................................................................................................................................................... 24
2.4.3 Soldering Conditions ........................................................................................................................................................................................ 25
CHAPTER 3 SYSTEM APPLICATION GUIDANCE ................................................................................................27
3.1 Application Guidance ........................................................................................................................................... 27
3.1.1 System connection ........................................................................................................................................................................................... 27
3.1.2 Interface Circuit (Direct Coupling Interface example for using one shunt resistor) ........................................................................................... 28
3.1.3 Interface Circuit (Example of Opto-coupler Isolated Interface) ......................................................................................................................... 29
3.1.4 External SC Protection Circuit with Using Three Shunt Resistors .................................................................................................................... 30
3.1.5 Circuits of Signal Input Terminals and Fo Terminal ........................................................................................................................................... 30
3.1.6 Snubber Circuit ................................................................................................................................................................................................ 32
3.1.7 Recommended Wiring Method around Shunt Resistor..................................................................................................................................... 33
3.1.8 Precaution for Wiring on PCB .......................................................................................................................................................................... 35
3.1.9 Parallel operation of DIPIPM ............................................................................................................................................................................ 36
3.1.10 SOA of Mini DIPIPM ....................................................................................................................................................................................... 36
3.1.11 SCSOA .......................................................................................................................................................................................................... 37
3.1.12 Power Life Cycles .......................................................................................................................................................................................... 38
3.2 Power Loss and Thermal Dissipation Calculation ................................................................................................ 39
3.2.1 Power Loss Calculation ................................................................................................................................................................................... 39
3.2.2 Temperature Rise Considerations and Calculation Example ............................................................................................................................ 41
3.3.1 Evaluation Circuit of Noise Withstand Capability .............................................................................................................................................. 42
3.3.2 Countermeasures and Precautions .................................................................................................................................................................. 42
3.3.3 Static Electricity Withstand Capability ............................................................................................................................................................... 43
CHAPTER 4 Bootstrap Circuit Operation................................................................................................................44
4.1 Bootstrap Circuit Operation .................................................................................................................................. 44
4.2 Bootstrap Supply Circuit Current at Switching State ............................................................................................ 45
4.3 Note for designing the bootstrap circuit ................................................................................................................ 46
4.4 Initial charging in bootstrap circuit ........................................................................................................................ 47
CHAPTER 5 PACKAGE HANDLING ......................................................................................................................48
5.1 Packaging Specification ....................................................................................................................................... 48
5.2 Handling Precautions ........................................................................................................................................... 49
Table of contents
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Related Manuals for Mitsubishi Electric PSS**S72FT
Summary of Contents for Mitsubishi Electric PSS**S72FT
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Page 1: Table Of Contents
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE PSS**S72FT Table of contents CHAPTER 1 INTRODUCTION ..........................2 1.1 Features of 1200V Mini DIPIPM with BSD ......................2 1.2 Functions ................................3 1.3 Target Applications ..............................4 1.4 Product Line-up .............................. -
Page 2: Chapter 1 Introduction
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE CHAPTER 1 INTRODUCTION 1.1 Features of 1200V Mini DIPIPM with BSD Mini DIPIPM with BSD is an ultra-small compact intelligent power module with transfer mold package favorable for larger mass production. Power chips, drive and protection circuits are integrated in the module, which make it easy for AC400-440V class low power motor inverter control. -
Page 3: Functions
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 1.2 Functions 1200V Mini DIPIPM has following functions and inner block diagram is described in Fig.1-2-1. ● For P-side IGBTs: - Drive circuit; - High voltage level shift circuit; - Control supply under voltage (UV) lockout circuit (without fault signal output). -
Page 4: Target Applications
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 1.3 Target Applications Motor drives for low power industrial equipments and household equipment such as air conditioners and so on. (Except for vehicle application) 1.4 Product Line-up Table 1-4-1 1200V Mini DIPIPM Line-up (Mini DIP with BSD series package) (Note 1) (Note 1) -
Page 5: Chapter 2 Specifications And Characteristics
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE CHAPTER 2 SPECIFICATIONS AND CHARACTERISTICS 2.1 1200V Mini DIPIPM with BSD Specifications 1200V Mini DIPIPM specifications are described below by using PSS10S72FT (10A/1200V) as an example. Please refer to respective datasheet for the detailed description of other types. 2.1.1 Maximum Ratings The maximum ratings of PSS10S72FT are shown in Table 2-1-1. - Page 6 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE (7) Tc position Tc (case temperature) is defined to be the temperature just beneath the specified power chip. Please mount a thermocouple on the heat sink surface at the defined position to get accurate temperature information. Due to the control schemes such different control between P and N-side, there is the possibility that highest Tc point is different from above point.
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Page 7: Thermal Resistance
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.1.2 Thermal Resistance Table 2-1-2 shows the thermal resistance of PSS10S72FT. Table 2-1-2 Thermal resistance of PSS10S72FT THERMAL RESISTANCE Limits Symbol Parameter Condition Unit Min. Typ. Max. Junction to case thermal Inverter IGBT part (per 1/6 module) th(j-c)Q... -
Page 8: Electric Characteristics And Recommended Conditions
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.1.3 Electric Characteristics and Recommended Conditions Table 2-1-3 shows the typical static characteristics and switching characteristics of PSS10S72FT. Table 2-1-3 Static characteristics and switching characteristics of PSS10S72FT. = 25°C, unless otherwise noted) INVERTER PART Limits... - Page 9 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Table 2-1-4 shows the typical control part characteristics of PSS20S71F6. Table 2-1-4 Control (Protection) characteristics of PSS20S71F6 = 25°C, unless otherwise noted) CONTROL (PROTECTION) PART Limits Symbol Parameter Condition Unit...
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Page 10: Mechanical Characteristics And Ratings
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE P Side Control Input Internal IGBT Gate Output Current Ic Real line: off pulse width > PWIN(off); turn on time t1 Broken line: off pulse width < PWIN(off); turn on time t2 (t1:Normal switching time) About Control supply variation If high frequency noise superimposed to the control supply line, IC malfunction might happen and cause DIPIPM erroneous... -
Page 11: Protective Functions And Operating Sequence
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.2 Protective Functions and Operating Sequence Mini DIPIPM has Short circuit (SC), Under Voltage of control supply (UV) and temperature output (VOT) for protection function. The operating principle and sequence are described below. 2.2.1 Short Circuit Protection 1. - Page 12 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3. Determination of Shunt Resistance (1) Shunt resistance The value of current sensing resistance is calculated by the following formula: Shunt SC(ref) where V is the SC trip voltage. SC(ref) The maximum SC trip level SC(max) should be set less than the IGBT minimum saturation current which is 1.7 times as large as the rated current.
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Page 13: Control Supply Uv Protection
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.2.2 Control Supply UV Protection The UV protection is designed to prevent unexpected operating behavior as described in Table 2-2-4. Both P-side and N-side have UV protecting function. However, fault signal (Fo) output only corresponds to N-side UV protection. - Page 14 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE [N-side UV Protection Sequence] a1. Control supply voltage V exceeds under voltage reset level (UV ), but IGBT turns ON by next ON signal (LH). (IGBT of each phase can return to normal state by inputting ON signal to each phase.) a2.
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Page 15: Temperature Output Function
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.2.3 Temperature output function V (1) Usage of this function This function measures the temperature of control LVIC by built in temperature sensor on LVIC. The heat generated at IGBT and FWDi transfers to LVIC through molding resin of package and outer heat sink. So LVIC temperature cannot respond to rapid temperature rise of those power chips effectively. - Page 16 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE In the case of using with low voltage controller(MCU) In the case of using V with low voltage controller (e.g. 3.3V MCU), V output might exceed control supply voltage 3.3V when temperature rises excessively.
- Page 17 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.76 2.64 2.51 Output range without 5kΩ pull down resistor (Output might be saturated under this level.) Output range with 5kΩ pull down resistor Max. Typ. Min. (Output might be saturated under this level.) LVIC temperature (°C) Fig.2-2-12 V output vs. LVIC temperature (3) Usage of V function As mentioned above, the heat of power chips transfers to LVIC through the heat sink and package, so the relationship between LVIC temperature: Tic(=V output), case temperature: Tc(under the chip defined on datasheet), and junction temperature: Tj depends on the system cooling condition, heat sink, control strategy,...
- Page 18 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Table 2-2-7 Outer heat sink Heat sink size ( W x D x H ) 200 x 85 x 40 mm Loss [W] Fig.2-2-13 Example of relationship of Tj, Tc, Tic One IGBT chip turns on.
- Page 19 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 5) Tj: 117℃ ~147℃ 1) 135℃ 5) Tc: 100℃ ~120℃ 4) 90℃ 2) 85℃ 4) 80℃ Loss [W] Fig.2-2-14 Relationship of Tj, Tc, Tic(Enlarged graph of Fig.2-2-13) Typ.
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Page 20: Package Outlines
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.3 Package Outlines 2.3.1 Package outlines QR Code is registered trademark of DENSO WAVE INCORPORATED in JAPAN and other countries. Fig.2-3-1 PSSxxS72FT package outline drawing (Dimension in mm) Publication Date: September 2015... -
Page 21: Marking
The laser marking specifications of Mini DIPIPM is described in Fig.2-3-2. Mitsubishi Corporate crest, Type name, Lot number, and QR code mark are marked in the upper side of module. PSS**S72FT Lot number “JAPAN” mark is printed for JAPAN product only. -
Page 22: Terminal Description
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.3.3 Terminal Description Table 2-3-1 Terminal description (PSSxxS72FT) Symbol Description U-phase P-side drive supply GND terminal (UPG) Dummy-pin U-phase P-side drive supply positive terminal U-phase P-side control supply positive terminal (COM) Dummy-pin U-phase P-side control input terminal... - Page 23 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Table 2-3-2 Detailed description of input and output terminals Item Symbol Description Drive supply terminals for P-side IGBTs. By virtue of applying the bootstrap circuit scheme, individual isolated power ...
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Page 24: Mounting Method
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 2.4 Mounting Method This section shows the electric spacing and mounting precautions of Mini DIPIPM. 2.4.1 Electric Spacing The electric spacing specification of Mini DIPIPM is shown in Table 2-4-1 Table 2-4-1 Minimum insulation distance(minimum value) Clearance(mm) Creepage(mm) -
Page 25: Soldering Conditions
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Measurement part for heat sink flatness Outer heat sink Fig.2-4-2 Measurement point of heat sink flatness(PSSxxS71F6) In order to get effective heat dissipation, it is necessary to enlarge the contact area as much as possible to minimize the contact thermal resistance. - Page 26 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE (2) Hand soldering Since the temperature impressed upon the DIPIPM may changes based on the soldering iron types (wattages, shape of soldering tip, etc.) and the land pattern on PCB, the unambiguous hand soldering condition cannot be decided.
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Page 27: Chapter 3 System Application Guidance
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE CHAPTER 3 SYSTEM APPLICATION GUIDANCE 3.1 Application Guidance This chapter states the Mini DIPIPM application method and interface circuit design hints. 3.1.1 System connection Bootstrap circuit P-side input (PWM) C1: Electrolytic type with good temperature and frequency characteristics Note: the capacitance also depends on the PWM control strategy of the application system P-side input (PWM) -
Page 28: Interface Circuit (Direct Coupling Interface Example For Using One Shunt Resistor)
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.2 Interface Circuit (Direct Coupling Interface example for using one shunt resistor) Fig.3-1-2 shows a typical application circuit of interface schematic, in which control signals are transferred directly input from a controller (e.g. -
Page 29: Interface Circuit (Example Of Opto-Coupler Isolated Interface)
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.3 Interface Circuit (Example of Opto-coupler Isolated Interface) IGBT1 C1 D1 C2 HVIC IGBT2 C1 D1 C2 HVIC (10) (12) (15) IGBT3 (13) C1 D1 C2 HVIC (16) (18) IGBT4... -
Page 30: External Sc Protection Circuit With Using Three Shunt Resistors
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.4 External SC Protection Circuit with Using Three Shunt Resistors DIPIPM Drive circuit P-side IGBT External protection circuit N-side IGBT Comparators (Open collector output type) Vref Drive circuit Protection circuit OR output Vref... - Page 31 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 5V line 10kΩ DIPIPM MCU/DSP 3.3kΩ (min) (Logic) Fig.3-1-6 Control input connection Note: The RC coupling (parts shown in the dotted line) at each input depends on user’s PWM control strategy and the wiring impedance of the printed circuit board.
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Page 32: Snubber Circuit
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE (2) Internal Circuit of Fo Terminal terminal is an open drain type, it should be pulled up to a 5V supply as shown in Fig.3-1-6. Fig.3-1-8 shows the typical V-I characteristics of Fo terminal. The maximum sink current of Fo terminal is 1mA. If opto-coupler is applied to this output, please pay attention to the opto-coupler drive ability. -
Page 33: Recommended Wiring Method Around Shunt Resistor
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.7 Recommended Wiring Method around Shunt Resistor External shunt resistor is employed to detect short-circuit accident. A longer wiring between the shunt resistor and DIPIPM causes so much large surge that might damage built-in IC. To decrease the pattern inductance, the wiring between the shunt resistor and DIPIPM should be as short as possible and using low inductance type resistor such as SMD resistor instead of long-lead type resistor. - Page 34 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Influence of pattern wiring around the shunt resistor is shown below. DIPIPM Drive circuit P-side IGBTs External protection circuit DC-bus current path N-side IGBTs Drive circuit Shunt resistor SC protection Fig.3-1-12 External protection circuit (1) Influence of the part-A wiring...
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Page 35: Precaution For Wiring On Pcb
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.8 Precaution for Wiring on PCB Floating control supply V and V wire potential fluctuates between Vcc and GND potential at switching, so it may cause malfunction if wires for control (e.g. -
Page 36: Parallel Operation Of Dipipm
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.9 Parallel operation of DIPIPM Fig.3-1-14 shows the circuitry of parallel connection of two DIPIPMs. Route (1) and (2) indicate the gate charging path of low-side IGBT in DIPIPM No.1 & 2 respectively. In the case of DIPIPM 1, the parasitic inductance becomes large by long wiring and it might have a negative effect on DIPIPM's switching operation. -
Page 37: Scsoa
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.11 SCSOA Fig.3-1-16~17 show the typical SCSOA performance curves of each products. (Conditions: Vcc=800V, Tj=125°C at initial state, Vcc(surge)≤1000V(surge included), non-repetitive,2m load.) In the case of PSS05S72FT, it can shutdown safely an SC current that is about 20 times of its current rating under the conditions if the IGBT conducting period is less than about 4.5μs. -
Page 38: Power Life Cycles
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.1.12 Power Life Cycles When DIPIPM is in operation, repetitive temperature variation will happens on the IGBT junctions (∆Tj). The amplitude and the times of the junction temperature variation affect the device lifetime. Fig.3-1-18 shows the IGBT power cycle curve as a function of average junction temperature variation (∆Tj). -
Page 39: Power Loss And Thermal Dissipation Calculation
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.2 Power Loss and Thermal Dissipation Calculation 3.2.1 Power Loss Calculation Simple expressions for calculating average power loss are given below: ● Scope The power loss calculation intends to provide users a way of selecting a matched power device for their VVVF inverter application. - Page 40 <Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE FWDi recovery characteristics can be approximated by the ideal curve shown in Fig.3-2-1, and its dynamic loss can be calculated by the following expression: Fig.3-2-1 Ideal FWDi recovery characteristics curve ...
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Page 41: Temperature Rise Considerations And Calculation Example
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.2.2 Temperature Rise Considerations and Calculation Example Fig.3-2-2 shows the typical characteristics of allowable motor rms current versus carrier frequency under the following inverter operating conditions based on power loss simulation results. Conditions: V =300V, V =15V, V... -
Page 42: Evaluation Circuit Of Noise Withstand Capability
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.3 Noise and ESD Withstand Capability 3.3.1 Evaluation Circuit of Noise Withstand Capability 1200V Mini DIPIPM series have been confirmed to be with over +/-2.0kV noise withstand capability by the noise evaluation under the conditions shown in Fig.3-3-1. -
Page 43: Static Electricity Withstand Capability
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 3.3.3 Static Electricity Withstand Capability DIPIPM has been confirmed to be with typical +/-200V or more withstand capability against static electricity from the following tests shown in Fig.3-3-3, 4. The results (typical data) are described in Table 3-3-1. LVIC HVIC R=0Ω... -
Page 44: Chapter 4 Bootstrap Circuit Operation
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE CHAPTER 4 Bootstrap Circuit Operation 4.1 Bootstrap Circuit Operation For three phase inverter circuit driving, normally four isolated control supplies (three for P-side driving and one for N-side driving) are necessary. But using floating control supply with bootstrap circuit can reduce the number of isolated control supplies from four to one (N-side control supply). -
Page 45: Bootstrap Supply Circuit Current At Switching State
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 4.2 Bootstrap Supply Circuit Current at Switching State Bootstrap supply circuit current I at steady state is maximum 1.10mA. But at switching state, because gate charge and discharge are repeated by switching, the circuit current exceeds 1.10mA and increases proportional to carrier frequency. -
Page 46: Note For Designing The Bootstrap Circuit
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 4.3 Note for designing the bootstrap circuit When each device for bootstrap circuit is designed, it is necessary to consider various conditions such as temperature characteristics, change by lifetime, variation and so on. Note for designing these devices are listed as below. -
Page 47: Initial Charging In Bootstrap Circuit
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 4.4 Initial charging in bootstrap circuit In the case of applying bootstrap circuit, it is necessary to charge to the BSC initially because voltage of BSC is 0V at initial state or it may go down to the trip level of under voltage protection after long suspending period (even 1s). -
Page 48: Chapter 5 Package Handling
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE CHAPTER 5 PACKAGE HANDLING 5.1 Packaging Specification (55) Quantity: (19) Plastic Tube 9pcs per 1 tube DIPIPM (520) Total amount in one box (max): Tube Quantity: 4 × 8=32pcs 4 columns IPM Quantity(max.): 32 ×... -
Page 49: Handling Precautions
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE 5.2 Handling Precautions Cautions ！ Transportation ·Put package boxes in the correct direction. Putting them upside down, leaning them or giving them uneven stress might cause electrode terminals to be deformed or resin case to be damaged. -
Page 50: Publication Date: September
<Dual-In-Line Package Intelligent Power Module> 1200V Mini DIPIPM with BSD Series APPLICATION NOTE Revision Record Rev. Date Points 1/9/2015 Publication Date: September 2015... - Page 51 •The prior written approval of Mitsubishi Electric Corporation is necessary to reprint or reproduce in whole or in part these materials.