D-NE20/NE20LS
5-2. PRINTED WIRING BOARD – EGH BOARD (SIDE A) –
EGH BOARD
(SIDE A)
A
JACK
BOARD
CN9002
(Page 19)
• Semiconductor
Location
Ref. No.
Location
IC403
D-4
IC601
C-9
IC602
D-8
IC603
C-7
IC605
C-10
IC606
A-7
IC3007
D-3
Q601
C-5
D-NE20/NE20LS
:Uses unleaded solder.
IC3007
IC403
IC606
*
IC603
*
CSP
(Chip Size Package)
14
14
OPTICAL PICK-UP
BLOCK
(DAX-25EV)
JE, HK, KR, CH
IC601
IC605
*
R622
*
CSP
(Chip Size Package)
IC602
AEP, UK, EE
EXCEPT
AEP, UK, EE
11
1-863-862- (11)