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HP OMEN X Disassembly Instructions Manual
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HP OMEN X Disassembly Instructions Manual

Product end-of-life disassembly
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Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
OMEN X by HP Laptop PC 17
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
M/B , Audio Board, Power Board, DB ,TP BOARD
All types including standard alkaline and lithium
coin or button style batteries Main Battery
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps 17.3"
Power Cord
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
5
1
1
1
Page 1

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Summary of Contents for HP OMEN X

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 36. Remove Hinge BKT L/R 37. Pull out Camera/ LED module Cable 38. Remove Antenna cable 39. Dis-fasten Hinge screw *6 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). 3.21 Total part disassembly 3.22 Remove battery module 3.23 Remove service door (N/A)
  • Page 4  Remove Bezel  Remove Panel  Remove Hinge BKT L/R  Remove Camera  Remove Hinge (LCD /Antenna Cable) EL-MF877-00 Page 4 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 5 3.25 Top case disassembly  Remove center hook & Battery  Remove Trunk assy  Remove Thermal Fan / SSD / Thermal module /HDD EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 6  Remove Speaker  Remove TP module /DC Jack / K-Lock BKT & PW /Audio Board & DB ,KB EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 7 3.26 Thermal module and mother board disassembly  Remove Trunk assy EL-MF877-00 Page 7 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 8  Remove Thermal Fan  Remove SSD  Remove Thermal Module EL-MF877-00 Page 8 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 9  Remove PCBA 3.27 Bottom case disassembly EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...